Latest Blogs and Commentary
Qualcomm BB91C Surface Acoustic Wave (SAW) Filter Die from the Qualcomm QPM7815 MHB FEM Process Analysis
This report presents an acoustic wave filter process analysis of the Qualcomm BB91C Surface Acoustic Wave (SAW) Filter Die, from the Qualcomm QPM7815 MHB front end module. The die and module were extracted from the Samsung Galaxy S23 Ultra 5G smartphone.
Webinar: Sustainability in the Semiconductor Industry: A TechInsights Perspective
Industries around the world are focused on ways to reduce carbon emissions in their own production processes but also in their supply chain. This is no different for the semiconductor industry which is heavily dependent on chemicals, power, and water to manufacturer the increasingly smaller process nodes.
Goodix 0.036 MP, 7.45 μm Pixel Pitch, Front-Illuminated In-Display Fingerprint CMOS Image Sensor Device Essentials Folder
This report presents a device essentials folder (DEF) of the Goodix 0.036 MP, 7.45 μm Pixel Pitch, Front-Illuminated In-Display Fingerprint CMOS Image Sensor, extracted from the IQOO Z7 5G smartphone.
GlobalFoundries’ GTC 2023
GlobalFoundries’ GTC 2023 G. Dan Hutcheson The Chip Insider® Summary: GlobalFoundries’ GTC 2023: News out of last month’s GF Global Technology Conference in San Jose was quickly overtaken by this month’s events, including GF’s 450K 300mm WSPY fab
Arm Licenses Neoverse N2 Subsystem
Arm’s new licensable Neoverse CSS N2 provides an entire compute subsystem implemented and verified on TSMC’s 5 nm process. It may save customers months of work.
Inuitive’s NU4100 Targets 3D Sensing
Israeli startup Inuitive has released the NU4100 chip for 3D image processing. Incorporating the company's image-processing accelerators and technology from Arm and Synopsys, the chip targets autonomous machines, AR/VR, and the smarthome market.
Convenient Power CPS4038 Power Management IC PMIC Process Analysis Summary
Convenient Power CPS4038 Power Management IC PMIC Process Analysis Summary Share This Post This report presents a PMIC process analysis (PEF) of the Convenient Power CPS4038 Power Management IC, extracted from the Samsung Galaxy S23 Ultra smartphone
IAA 2023: SoC Market Strategies Diverge in Centralized Architectures
TechInsights attended a series of discussions and demonstrations at the 2023 IAA Munich Auto Show by the main SoC (System-on-Chip) vendors, Mobileye, NVIDIA, and Qualcomm.
IAA 2023: SoC Market Strategies Diverge in Centralized Architectures - Powertrain, Body, Chassis & Safety
TechInsights attended a series of discussions and demonstrations at the 2023 IAA Munich Auto Show by the main SoC (System-on-Chip) vendors, Mobileye, NVIDIA, and Qualcomm.
Tablet Shipments, Revenue, Installed Base, and Penetration Forecast by Form Factor by 88 Countries 2010-2028: Q3 23 Update
The basic slate is still a favorite device for casual, lean-back activities such as watching videos, gaming, and social media; Detachable 2-in-1s have evolved into high performance PC replacements as versatility and mobility serves enterprise demand, prosumer demand, and now broader appeal to consumers with affordable, powerful Android and iPadOS options.
Notebook PC Shipments, Revenue, Installed Base, and Penetration Forecast by 88 Countries 2010-2028: Q3 23 Update
From the Windows 10 commercial refresh to historic demand due to COVID work and school restrictions, the Notebook PC installed base has grown 29% in the last four years.
Deep Dive Teardown of the Google Pixel GTU8P Tablet
The Google Pixel Tab (GTU8P) is Google’s latest tablet. It contains the Octa-Core Google Tensor G2 Applications Processor. Samsung made the die (S5P9855). Most of the Power Management chips were also made by Samsung.
Deep Dive Teardown of the Athom B.V. Homey Pro HY0025 Smart Home
Supported technologies are Wi-Fi, Bluetooth Low Energy, Zigbee, Z-Wave-923 MHz, Z-Wave-914 MHz, Z-Wave-868 MHz, ISM/SRD-433 MHz, and Thread.
Deep Dive Teardown of the Aqara Door and Window Sensor P2 DW-S02 Smart Home
The Aqara Door and Window Sensor P2 DW-S02 for opening doors and windows works on the principle of contact between a magnet (Include Accessory Unit NE#17 Magnet) and a controller (Include Main Unit IC#2 Hall Effect Sensor).
Deep Dive Teardown of the Honor 90 REA-AN00 Smartphone
The Honor 90 5G Front Camera is a 50 MP CMOS BSI Sensor from Samsung (S5KJN1). The whole subsystem is 5.32 mm height, and the dimensions of the sensor housing are 8.85 x 8.24 mm.
SK hynix Powers Huawei Mate 60 Pro
As of our latest analysis, the Mate 60 Pro exclusively features SK hynix memory components. This blog breaks down the key findings along with exclusive images.
Analyzing the Global Apple iPhone Shipment Volume and Market Share
In this analysis, we'll delve into the data provided by WSS TechInsights, exploring key takeaways from the chart depicting Apple's iPhone shipment volume and market share from 2007 to a forecasted 2024.
Qorvo EG9381 Bulk Acoustic Wave Solidly Mounted Resonator (BAW-SMR) Filter Die Acoustic Wave Filter Process Analysis
This report presents a process analysis (AFB) of the Qorvo EG9381 Bulk Acoustic Wave Solidly Mounted Resonator (BAW-SMR) Filter Die from the Qorvo QPQ5600 Band-Pass Filter.
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