Latest Blogs and Commentary
MWC 2024: Telecoms Key Takeaways
This post-event report summarizes the top themes discussed at MWC 2024 (Mobile World Congress 2024) held from 26th Feb till 29th Feb in Barcelona. The report talks about AI the hottest topic this year at MWC across the entire telecom ecosystem and provides TechInsights' views on selected themes.
Tsingteng Micro THN31FWC1 NFC Controller Floorplan Analysis (IoTB)
This report describes a Basic Floorplan Analysis (BFR) of the Tsingteng Micro THN31FWC1 die found inside Tsingteng Micro THN31FWC1 component (a WLCSP). The THN31FWC1 was extracted from the 8849 TANK 3 smartphone.
Samsung K9YYGB8J1C-CCK0 176L QLC 3D NAND Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Samsung K93KGO8J0C 176L QLC 3D NAND found inside Samsung K9YYGB8J1C-CCK0. The K9YYGB8J1C-CCK0 was extracted from the Samsung T5 EVO MU-PH4T0S 4 TB Portable SSD drive.
Deep Dive Teardown of the Xiaomi 14 Pro 23116PN5BC Smartphone
The 32 MP front camera on the Xiaomi 14 Pro 23116PN5BC uses an OmniVision image sensor. Three back cameras are also included. The primary 50 MP wide-angle has an integrated OIS, an AF module, and an OmniVision image sensor. The 50 MP telephoto camera has an integrated OIS and AF module and uses a Samsung image sensor.
Intel Core Ultra 7 155H SRMZ1 Meteor Lake CPU Die Intel 4 FinFET Process Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the CPU die (die 1) found inside Intel SRMZ1 (Meteor Lake) component extracted from the Acer 14" Swift Go 14 Multi-Touch Laptop. Meteor Lake processors, the first generation of Intel Core Ultra processors, were launched December 14, 2023. It comprises 16 CPU cores: 6 performance cores (P-cores), 8 efficient cores (E-cores), and 2 low power efficient cores (LP E-cores).
MWC 2024: Key Takeaways for Personal Computing
This report summarizes major personal computing related announcements at Mobile World Congress 2024. Companies mentioned include Qualcomm, Intel, AMD, Arm, Lenovo, Dell, Samsung and Acer. Topics covered include AI, generative AI and sustainability.
Wi-Fi 7 Comes to the Automotive Industry
With the launch of the official certification for Wi-Fi 7, semiconductor companies, for example MediaTek and Qualcomm, have already launched automotive-specific connectivity products that support this new standard. This report discusses Wi-Fi 7, provides TechInsights’ forecasts for automotive Wi-Fi feature adoption, a summary of the new standard’s features and how it compares to previous generations of Wi-Fi.
Chip Observer (March 2024)
TechInsights' Chip Observer, a publication dedicated to monitoring the semiconductor market from production facilities to consumer endpoints.
MWC 2024: Smartphone and Wearable Wrap-Up
Mobile World Congress (MWC) – the world’s largest mobile industry event – took place in Barcelona, Spain from February 26 (Monday) to February 29 (Friday), 2024. The event saw over 101,000 attendees as well as more than 2,700 companies exhibit, sponsor, and partner in the event. Analysts from TechInsights attended the show. This is the wrap up report for our mobile device relevant findings in the show.
Mobile World Congress 2024: C-V2X Initiatives Multiplying
Mobile World Congress 2024 announcements impacting the automotive industry revolved around V2X and non-terrestrial-network connectivity via satellites. Autotalks was prominent in multiple announcements at the show for both current and anticipated modules and semiconductors supporting V2X communications.
Hardware Will Continue to be the Fuel That Powers Public Cloud Growth
Despite signs of a slowdown in public cloud growth, providers will still require a substantial quantity of processors, accelerators and other infrastructure to support continued demand and to replenish server stock.
Smart Home Platforms – March 2024
This database is updated annually and provides a comparison of key capabilities and attributes of 55 smart home platforms, covering both OEM-specific and licensable platforms. The list, although long, is not exhaustive, and updates will be made each year to reflect the market.
NAND Market Report Q1 2024
A comprehensive guide to the ever-changing NAND market, updated every quarter. This analysis covers supplier production trends, market shares, shipment volumes, revenue, and pricing forecasts. It examines the technological and manufacturing innovations influencing the industry and identifies the key developments driving market demand.
Samsung Leads Pro AI Generative Smartphone Revolution
Discover the latest insights on Samsung's leadership in the Pro AI smartphone revolution. Log in now to access the full report and stay informed about the future of mobile technology.
OECD Fixed Broadband Price Benchmarking Q4 2023
The Q4 2023 update of the OECD Fixed Broadband Price Benchmarking service is now available for download and includes over 1,500 fixed broadband tariff plans from more than 120 providers across 38 OECD countries.
Deep Dive Teardown of the Ring A19 Smart LED Bulb SAT1S3 Smart Bulb
Supplied by Nordic Semiconductor’s ANT/BT LE SoC #nRF52832, the Ring A19 Smart LED Bulb supports connectivity protocols such as BT 5.3, BT 2 Mpbs, BT Mesh and does not support Matter Connectivity Protocol, BT Long Range, BT Direction Finding, BT LE Audio or Thread, and Zigbee.
SK hynix H56G42AS8D-X014 8Gb GDDR6 DRAM D1y nm Advanced Memory Essentials
This is the first TechInsights identified DRAM product that has applied a high-k dielectric on periphery transistors in SK Hynix DRAM. This report presents an advanced memory essentials (AME) of the SK Hynix H56G42AS8D-X014 (H56G32CS Die) 8 Gb GDDR6 DRAM D1y nm.
Trackers: Connected TV Devices
These quarterly reports provide timely, tactical shipment, installed base and market share data for connected TV devices overall as well as smart TVs, streaming media players, and game consoles by vendor and TV operating system (TV OS). In addition to global tracking the following regions/countries are covered: North America, Central and Latin America, Western Europe, Central and Eastern Europe, Middle East and Africa, Asia Pacific.