Latest Blogs and Commentary
USA Smartphone Vendor Marketshare by Operator: Q3 2023
Smartphone shipments in the United States were down on annual basis in Q3 2023, though on a much smaller basis than in previous recent quarters. Apple was number one in hardware and Android led in software, with Samsung leading in the Android space.
USA Handset Vendor Marketshare by Operator: Q3 2023
ndset shipments in the United States declined year-on-year in Q3 2023. Apple led across major carriers, followed by Samsung, which led Android, and then by Motorola, and TCL-Alcatel.
Xumo Makes its Presence Felt in US Connected TV Market
Xumo, the 50/50 joint venture (JV) between Comcast and Charter Communications, was formed in April 2022 to develop and offer a next-generation streaming platform (i.e., TV operating system) on a variety of first and third-party 4K streaming devices and smart TVs.
Autonomous Vehicle Trials Database
This database covers the key companies, government bodies and cities which are trialing autonomous vehicle technologies and infrastructures for further research and development.
ADAS Mandate NCAP Tracker
This tracker is a top-level summary of the various mandates and New Car Assessment Program (NCAP) incentives and requirements that are either currently implemented or proposed across the globe.
Global Bluetooth TWS Shipments by Region : Q3 2023
Apple remains the shipments leader in Bluetooth True Wireless Stereo (TWS) headsets. AirPod Shipments declined YoY in Q3 2023. Overall TWS headsets growth has slowed down YoY.
Global Bluetooth TWS Shipments, Revenues and ASP by Price Tier by Vendor : Q3 2023
Apple remains the shipment and revenue leader in Bluetooth True Wireless Stereo (TWS) headsets in Q3 2023.
Codasip Protects Memory With Cheri
Codasip’s new A730-Cheri RISC-V application CPU is the first commercial implementation of the Cheri fine-grained approach to memory protection that enables omission of a large memory-protection unit
Mobile AI Builds An Installed Base
Deployment of powerful AI hardware establishes an installed base for new software, which is more important than showy generative-AI demos.
Scaling Turns Into More-Than-Moore
Integrated-circuit scaling has enabled semiconductors to become an indispensable part of industry. Moore’s Law and Dennard scaling have developed into design- and system-technology co-optimization to overcome the challenges posed by data centers, AI, and consumer demand.
TechInsights' Automotive Semiconductor Market Outlook
The automotive industry is undergoing a transformative shift, with electrification emerging as a driving force.
HiSilicon Kirin 9000s (SMIC 7nm, N+2) Process Flow Analysis
This report provides an analysis of the process flow and integration used in the manufacture of the HiSilicon 9000s (Hi36A0 GFCV120) SoC die that powers the latest flagship smartphone, the Mate 60 Pro, released in September 2023, from China-based Huawei, a surprise announcement despite US sanctions.
ams OSRAM Mira050, 1/7″ Format, 0.5MP Resolution, 2.79μm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor Device Essentials Folder
This device essentials folder (DEF) presents the ams OSRAM Mira050, 1/7″ Format, 0.5MP Resolution, 2.79 µm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor.
onsemi AR0823AT, 1/1.8″ Format, 8.3MP Resolution, 2.1μm Pixel Pitch, Stacked Back-Illuminated HDR and LFM CMOS Image Sensor (Hyperlux(TM) Super-Exposure Pixel Sensor) Device Essentials Folder
This report analyzes the onsemi AR0823AT which features a 1/1.8″ format, 8.3 MP resolution, 2.1 µm pixel pitch, stacked back-illuminated HDR and LFM CMOS image sensor for automotive applications.
USA: Smartphone Shipments & Marketshare by Model: Q3 2023
The United States is the world's most influential smartphone market. It delivers high volume and revenue to device makers, component suppliers, and operators.
Deep Dive Teardown of the Huawei Mate X5 ALT-AL10 Smartphone
The Huawei Mate X5 is a new foldable smartphone from Huawei. It is 14.76 mm thick at the thickest part when folded and 8.82 mm thick when unfolded.
Survey Plus Teardown of the Apple iPhone 15 A2846 Smartphone
The iPhone 15 features the 64-bit ARM based Apple’s A16 Bionic APL1W10 - the hexa-core applications processor, combining two Everest high-performance cores with four Sawtooth energy-efficient cores built on a TSMC 4nm process node die (N4P).
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
