Latest Blogs and Commentary
Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside. As first published in Semiconductor Digest.
SiC Power Transistor Process Flow Analysis: The Rohm SCT3022ALGC11 Process Flow
Contributed Author: Sinjin Dixon-Warren The market for Silicon Carbide (SiC) power transistors is expected to grow considerably over the coming years. SiC power transistors have several advantages over traditional silicon-based devices, including
Patent Portfolio Management: Effective Strategies and Best Practices in 2020
April 29 - 12:00-1:30 pm (ET) – Live webinar, "Patent Portfolio Management: Effective Strategies and Best Practices in 2020", hosted by The Knowledge Group. Key topics include: Patent Portfolio Management Trends and Developments, The Essentials of an
Choosing the right patent software for better results
There have never been so many IP tools and technology aides on the market, but how do you decide which ones are going to help your business? Martin Bijman of TechInsights explains.
Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to
Looking at the Apple A12Z Bionic System on Chip
Is the Apple A12Z bionic SoC just the A12X renamed, with an enabled GPU core? When we first got the Apple iPad Pro 2020 A2068 in our labs, this was the first thing we wanted to know. What is the A12Z? When we saw the A12Z, there was visually no
An update from TechInsights regarding COVID-19
TechInsights has been executing a business continuity plan since early February. As a global business, we first took measures in Asia and quickly cascaded those measures to our European and North American offices. My responsibilities are in this
TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
Last year, Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we
YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
Contributing Author: Jeongdong Choe Originally Posted March 12, Revised April 7 2020 TechInsights finally found 3D Xtacking® NAND devices manufactured from Yangtze Memory Technologies Co., Ltd. (YMTC) in Wuhan, China. With this device, YMTC has
Samsung Galaxy S20 Ultra 5G Camera Teardown
Contributing Authors: Ray Fontaine Congratulations to the Samsung team for not only delivering a well spec’d camera system, but also for being first to market with 0.7 µm generation pixels! The GH1 stacked imager, announced in September 2019 , is in
Samsung Galaxy S20 Ultra 5G Teardown Analysis
EXPERIENCE THE WEBINAR The Samsung Galaxy S23 Ultra - Inside the Flagship April 5, 2023 In this exclusive webinar, our experts will deliver an in-depth analysis of the components within this device, highlight what changed from previous versions, and
Recent Analysis of Samsung’s Mobile RF Components
Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors
Xiaomi Mi 10 Teardown Analysis
Here we were, waiting for the release of the Samsung Galaxy S20 so we could see the Qualcomm Snapdragon 865 mobile platform, and along came Xiaomi with their announcement on February 13 that the Mi 10 - also based on the Snapdragon 865 - would be
If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
Apple Inc’s surprise warning that it will likely fall short of this quarter’s sales target due to the coronavirus epidemic points to much pain for its chip and other suppliers as well as for rivals who also rely on China to build their products.
Recent MediaTek Mobile RF Components and Analysis
MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing
In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory is also limited.
Securing Smart Connected Homes with OTP NVM
The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly
PC technology trends 2020-DRAM and Flash
新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。
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