Latest Blogs and Commentary
Forecast: Automotive Semiconductor and Sensor Demand
This global forecast covers historical and future semiconductor and sensor demand for the automotive industry in USD and units. In 2024, automotive semiconductor demand is forecast to grow by 13% in USD to reach $80 billion; unit growth is expected at 7% surpassing 113 billion.
Survey Plus Teardown of the Tecno Spark Go 2024 BG6 Smartphone
The Tecno Spark Go 2024 BG6 is one of the latest Tecno smartphones. This device is one of the latest variants from Tecno Spark Go line and the successor to the Tecno Spark Go 2023.
The Chip Insider®– How Japan Lost its Semiconductor Industry
In all the discussions around China’s effort to gain leadership in semiconductors, the question of how Japan lost its position – with such a huge advantage – keeps coming up. In the end, there were six strategic causes behind the long-term failure of Japan’s semiconductor industry.
China's Semiconductor Production Capacity to Grow by 40% in Five Years
Gain insights into China's semiconductor industry with TechInsights, foreseeing a 40% capacity growth over five years, driven by equipment purchases and strategic investments, shaping global markets and trade policies.
Deep Dive Teardown of the Amazon Echo Show 8 3rd Gen R855D6 Smart Display
The design wins for the Amazon Echo Show 8 3rd Gen is divided between different manufacturers. The application processor comes from Amlogic while WiFi Front-end comes from Mediatek. As for the memory, SK Hynix provided 2 GB LPDDR4 SDRAM and Samsung provided 8 GB MLC NAND flash.
Advanced TSMC 22ULL Embedded RRAM Chip Unveiled
Discover the advanced TSMC 22ULL embedded Resistive RAM (eRRAM) chip featured in Nordic Semiconductor's latest nRF54L SoC devices.
GalaxyCore GC32E1 Standard Floorplan Analysis
The ISP from the periphery region of the Galaxycore GC32E1, a back-illuminated (BI) CMOS Image Sensor (CIS) for mobile cameras, was extracted from the Tecno Spark 20 front camera.
Canon LI5030SAC Device Essentials Folder
The Canon LI5030SAC is a Bayer color, 6.4 μm, front-illuminated (FI) charge domain global shutter (GS) full frame (FF) CIS for machine vision applications, acquired as a standalone part.
Survey Plus Teardown of the Samsung A35 5G SM-A356E/DS Smartphone
The Samsung A35 5G is equipped with the Samsung Exynos 1380 processor, while its predecessor, the Samsung A34, offers the Mediatek Dimensity 1080. The Samsung A35 5G offers 6, 8, and 12 GB of RAM, while the Samsung A34 5G can be equipped with 4, 6, or 8 GB RAM.
Q1 2024: Honor: Topped China and Solid Progress in Overseas Market
Driven by the growth in both overseas and China market, Honor’s global smartphone shipment increased 34% YoY to 17.0 million units. It also took the leadership in China this quarter. Solid progress in overseas markets has been made with record higher contribution this quarter since the split from Huawei. Despite a slight fall on average selling price (ASP), Honor posted significant annual revenue growth in Q1 2024.
A Tale of Two Foundries (TSMC and HLMC) and One Design House (HiSilicon)
Explore HiSilicon's Hi1105-GFCV100 module and its manufacturing journey between TSMC and HLMC foundries, highlighting the design consistency and adaptability in the semiconductor industry amidst global chip shortages.
Optimizing Battery Lifespan: MacBook Pro M3 vs Lenovo ThinkPad X1 Carbon Gen 11
Consumer electronics often grapple with battery pack swelling in lithium-ion batteries, attributed to factors like rapid charging, inadequate thermal regulation, and prolonged full charge states. This study compares swelling control mechanisms in MacBook Pro M3 and Lenovo ThinkPad X1 Carbon Gen 11.
Samsung K9AHGD8J0C 133L 512 Gb TLC 3D NAND Memory Floorplan Analysis
Analysis of the floorplan design used in the SAMSUNG K9AHGD8J0C (V9 PRIME Die) 133L 512 Gb TLC 3D NAND and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die/package cost analysis are provided.
Towering Memory: HBM and Verticality
The artificial intelligence (AI) arms race continues with key players AMD and Nvidia announcing competing products. The scale of deployments continues to expand, and the volume of required hardware is straining the supply chain and spurring new investments in advanced packaging production capacity.
Embedded Memories in PMICs – ReRAM and SONOS Memory Observations in Recently Analyzed Devices
Exploratory analysis results of a first ReRAM observations in a PMIC device: STMicroelectronics’ STWLC38 wireless charging receiver IC, including the process node and process type determination and a first look of the ReRAM structure.
Deep Dive Teardown of the Meta Quest 3 S3A VR Headset
Compared to the previous generation VR headset, the Oculus Quest 2, the Meta Quest 3 features upgraded hardware components. This includes a more powerful processor for improved performance, enhanced display technology for better visual fidelity, and upgraded tracking sensors for more accurate motion tracking.
Embedded & Emerging Memory Technology Roadmap – May 2024
The Memory Embedded and Emerging memory technology roadmap has been updated. Recently, industry leading emerging memory players such as TSMC, GlobalFoundries, Samsung, UMC, Fujitsu, Sony, Renesas, Everspin, and Avalanche introduced and revealed commercial STT-MRAM and ReRAM products used for the embedded memory applications.
Deep Dive Teardown of the Quectel CC660D-LS Wireless Module
The Quectel CC660D-LS is mainly based on MediaTek’s MT6825A. The CC660D-LS module offers versatile connectivity options, including L-band, S-band, and Band 23 connections. In addition, the module supports 3GPP Release 17 IoT non-terrestrial network (IoT-NTN) connections.
