Windows on Arm Helped and Hindered by New Surface Launch
Interest in Windows on Arm (WoA) is at a high point. Microsoft and Arm must take the opportunity to plug the remaining gaps and create a broader WoA ecosystem.
Taiwan’s Green Energy Conundrum – Balancing Increasing Demand with Sustainability Targets
Taiwan's ambitious net-zero emissions goal by 2050 faces challenges due to limited resources, high tech sector demands, reliance on imported fuels, and a contentious energy debate, despite significant gains in renewable energy.
Unveiling Spatial Computing in the Apple Vision Pro: The Sensors Powering the Future
The Apple Vision Pro headset introduces a new level of immersive computing through "spatial computing," merging virtual widgets with your real-world environment.
Innovative PVDF/Al2O3 Separator Boosts Amazon Echo Frame 3rd Gen Battery Safety
Innovative PVDF/Al2O3 Separator Boosts Amazon Echo Frame 3rd Gen Battery Safety Discover how the Amazon Echo Frame 3rd Gen achieves high energy density and enhanced safety with its innovative PVDF/Al2O3 battery separator. Learn about the design, materials, and performance features that make it a
ODM Sales Soar as Hyperscalers and Cloud Providers Go Direct
Discover how ODM sales are soaring as hyperscalers and cloud providers like AWS and Google go direct, reshaping the server market with custom silicon and hybrid cloud strategies.
AWS NVIDIA Shortages Demonstrate Need for Custom Silicon
Discover how ongoing NVIDIA shortages are driving the need for custom silicon in cloud computing. Explore the benefits and future implications of proprietary chips from AWS, Microsoft, Alibaba, and Google in a rapidly evolving market.
T1-2024 Emerging and Embedded Memory Briefing
This briefing delves into the latest developments in emerging non-volatile memories (EM), encompassing products, technology trends, comparisons, and opportunities for devices like STT-MRAM, PCRAM, ReRAM/CBRAM, and FeRAM. It also covers the technology roadmaps and challenges faced by leading EM foundries.
May in Review: AI at the Edge
Processor companies are packing more neural processing capability into processors for IoT edge devices. Here’s a look back at several of these that we covered in May.
Meta’s AR Enhanced by 3D Packaging
Meta’s Reality Labs discussed a prototype AR processor at the 2024 ISSCC, fabricated using hybrid bonding as 3D packaging. This improved performance for the trial tasks of hand tracking and image processing.
DRAM Memory Technology Roadmap Update for Q2 2024
Discover the latest advancements in DRAM technology as of Q2 2024, including updates on EUV lithography, HKMG processes, and emerging 3D DRAM developments from industry leaders like Samsung, SK hynix, and Micron.
