Featured Report Analysis
Find Us At The Chiplet Summit 2025
TechInsights' Advanced Packaging team will be in attendance, and presenting at, the Chiplet Summit 2025 from January 21-23rd, Santa Clara California. Register now to see us in person, or stay tuned for our key take aways from the event.
Intel Core Ultra 7 258 (Lunar Lake) Advanced Packaging Quick Look Analysis
Discover Intel's Lunar Lake advancements in chiplet design and Foveros packaging. Explore co-packaged memory, metallization differences, and new features in our detailed structural and material analysis.
Narrative: Smartphone Vendor Market Share for 60 Countries: Q3 2024
See how 60 countries drove 89.5% of the global smartphone market in Q3 2024. Explore top players Apple, Samsung, Xiaomi, and challenges for local vendors in this analysis.
Qualcomm Snapdragon X Elite SoC Advanced Packaging Quick Look
Explore the groundbreaking Snapdragon X Elite processor from Qualcomm, advancing ARM-based processors in PCs. Dive into our detailed analysis of its packaging structure and thermal performance design.
Narrative: Smartphone Memory Market Share Q3 2024
Discover insights into the 57% YoY revenue surge in the smartphone memory market in Q3 2024. Explore key drivers like AI adoption, seasonal demand, and ASP growth. Get the full analysis in our latest report.
Qualcomm Snapdragon 8 Gen 4 Digital Floorplan Analysis
Explore the Qualcomm Snapdragon 4 Elite in the Xiaomi 15 Pro 5G with Oryon CPUs, Adreno GPU, and TSMC FinFlex. Dive into our analysis of process nodes, BEOL, and costs.
Analysis: Tier One Automotive ECU Market Share Estimates 2024
Discover market share insights of leading automotive ECU vendors, with regional and global breakdowns across key vehicle domains.
MediaTek MT6199W FR1 RF Transceiver Floorplan Analysis
Explore the MediaTek BM11228A1 die inside the MT6199W FR1 RF transceiver, extracted from the vivo X200 Pro, showcasing advancements in RF mobile connectivity.
Analysis – Five Key Trends for Power Semiconductors in 2025
Discover the key factors behind the 8% decline in the $46.8B power semiconductor market in 2024 and explore growth opportunities for 2025.
Apple Watch X SiP (Series10) Advanced Packaging Quick Look Analysis
Discover the the advanced packaging innovations used in the manufacturing of the Apple APL1W15 integrated fanout package-on-package (InFO-PoP).
Intel Xeon 6731E (Sierra Forest) CPU Die Intel 3 FinFET Process Advanced CMOS Essentials
Explore the structure and materials used in the manufacture of the Intel Xeon 6731E (Sierra Forest) CPU die and its advanced compute chiplet design.
YMTC YMN09TF1B1JCAE_die 160L (Xtacking4.0) 512 Gb TLC 3D NAND Process Analysis
Explore the Advanced Memory Essentials (AME) report of the YMTC YMN09TF1B1JCAE_die featuring the YMTC’s fifth-generation (Xtacking4.0) 3D NAND flash memory.
Netsol S3A1604V0M 16Mb STT-MRAM Floorplan Analysis
Dive into the Memory Floorplan Analysis of the Netsol S3A1604V0M MRAM die found inside the Netsol S3A3204R0M-AI1AT.
SmartSens SC100AT Device Essentials Plus
Explore TechInsights' analysis of the SmartSens SC100AT BI CMOS image sensor, designed for automotive applications with PixGain HDR and SmartClarity-2 technologies, featuring a 140dB dynamic range and 1.3 MP resolution.
Semiconductor CAPEX Forecast
Explore worldwide CAPEX trends for foundry and IDM companies by segment, from 2010 to forecasts for up to the next five years.
The McClean Report December Update
December McClean Report: Top-25 semiconductor sales, 2024 forecast insights, and 2025 outlook. Dive into the full report.
Analysis: Chinese OEM’s International Market Expansion—Geely, Great Wall and SAIC
Uncover an in-depth analysis of Chinese automakers' global expansion, focusing on their international strategies, energy models, and key challenges.
Editorial: After Gelsinger, Intel Faces Tough Choices
Explore Pat Gelsinger's journey as Intel's seventh CEO. Gain insights into the past successes, challenges, and potential next steps for Intel's leadership.