This report provides an overview into the structure of the OmniVision OX08D10 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed, and is accompanied by a set of optical, SEM cross-section, and bevel images of both CIS and ISP dies.

The PCB design of the Huawei Pura 70 Pro (HBN-AL00) consists of eleven substrates but only two of them (Main Board and RF Board) are mostly used for RF communication. Most of the cellular communication is situated on the first side of the RF Board while the whole non-cellular (WiFi/BT/GPS) design is placed on both sides of the Main Board with some minor additions of other cellular chips between them.

Analysis of the process flow and integration used in the manufacture of the AMD Ryzen 9 7950X3D compute die (CCD), built using TSMC's N5 HPC FinFET process. The spreadsheet lists the hundreds of process flow steps required in its manufacture.

In the ZTE Nubia Z60 Ultra NX721J TechInsights found the following for the first time: Multichip Memory -16 GB Mobile LPDDR5X SDRAM Samsung #K3KL5L50CM-BGCW, Power Management Qualcomm #PM8550B-001, Camera Power Management Qualcomm #PM8010-1U4, HB/MB Front-End Module Qorvo #QM77058F.

The June Update to The McClean Report examines semiconductor industry research and development trends. An overview of R&D spending is followed by a review of investment growth since the 1990s, R&D expenditures as a percent of annual sales, a ranking of top R&D spenders, and regional trends in R&D spending.

This monthly update delves into the dynamic and volatile pricing landscape of mainstream DRAM and NAND memory, offering an examination of pricing trends over the past three months and projecting developments for the upcoming year.

Global Smartphone Monthly Shipments (Sell In), Sales (Sell Through) and Inventory Variance by Vendor: June 2024 Share This Post TechInsights-tracked global smartphone shipments (sell in) and sales (sell through) grew by 5% and 6% YoY respectively in May 2024. We noted shipments annual growth rate

TechInsights has compiled quarterly financial data for a sampling of Integrated Device Manufacturers (IDMs), Fabless semiconductor companies, Foundries, and Outsourced Assembly and Test contractors (OSAT) important to the automotive industry. All companies selected are public (private companies were not included).

It is well known that the fashion world recycles trends every 20 years as a younger generation looks to distinguish themselves from their older peers and the trends they grew up with become commoditized and uncool. If Computex 2024 was any indication of the future of the PC market, a similar resurgence is set to happen in the PC industry, with the major silicon players (and Microsoft) leading the charge to make the PC cool again.

As per the smartphone research from TechInsights, Asia Pacific (APAC) smartphone market shipments grew 8% YoY but declined 7% QoQ in Q1 2024.

The Q2 2024 OECD Fixed Voice and Leased Line Price Benchmarking Service update is now available for download. The services incorporate the OECD 2017 baskets, the latest baskets available for fixed voice and leased lines. It is possible to view the results in a wider range of currencies.