Quectel announced RG255C-GL module with 5G reduced capacity sub-6GHz on April 9, 2024 designed for global market. It is embedded with Qualcomm Snapdragon SDX35 Baseband Processor and JSFCBA3YH3BBG-425 RAM/NAND memory from Jeju Semiconductor.

Global smartwatch revenues fell by 4% YoY during Q1 2024. The decline was driven by slumping shipment volumes and declining ASPs due to macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending and causing a lengthening replacement cycle.

The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.

This process analysis report examines the TF-SAW filter die, marked 122B050-A1, located in the 90SSPNWAM mid-high band power amplifier with an integrated low noise amplifier and duplexer (MHB L-PAMiD) within the Huawei Nova 12 Pro (ADA-AL00) 5G smartphone.

This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro SoC CPU. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.

The HiSilicon Hi1105GFCV100 WiFi/BT/GNSS SoC was fabricated using HLMC’s 28nm HKMG planar RF CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.

This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.

This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.

Global smartwatch revenues shrunk by 1.5% in Q1 2024 due to declining shipment volumes as well as shrinking ASPs caused by macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending.

TechInsights has compiled quarterly financial data for a sampling of Tier 1s important to the automotive industry. All companies selected are public (private companies were not included). Total company revenues (including possibly non-automotive sales if applicable) are listed along with Gross Margins and Operating Margins.

TechInsights' report on HBM and Verticality evaluates the impact of High Bandwidth Memory on DRAM die stacking within single accelerator cards as well as how fabs and the supply chain are reacting to this trend.

The Nordic nRF54L15 Bluetooth 5.4 Systems-on-Chip (SoC), the first SoC in the nRF54L series which begins sampling in October 2023, features a 128 MHz Arm Cortex-M33 processor, 1.5 MB (equivalent of 12 Mb) of non-volatile memory (NVM) and 256 KB of RAM. The Nordic TMRC83 die is fabricated using TSMC 22 nm ultra-low leakage (22ULL) with embedded resistive random-access memory (eReRAM) process.