May highlights in sensors digest of recently completed technical analysis includes STMicroelectronics 56G812A1A, OmniVision OV50X, Samsung ISOCELL Vizion 931, and more.

Summary deep dive teardown of The Apple iPad Pro 13-inch M5 includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.

Summary deep dive teardown of The Samsung Galaxy S26 Exynos 2600 includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.

Results of TechInsights survey of consumer awareness of core technologies in ADAS, OTA Updates, and software and AI features.

Unboxing video of the Huawei Pura X Max, a foldable smartphone with LTPO OLED display, Kirin 9030 Pro processor and a triple-camera system.

Device teardown video of the Huawei Pura X Max, a foldable smartphone with LTPO OLED display, Kirin 9030 Pro processor and a triple-camera system.

Intel and SoftBank unveil collaboration on Z-angle memory, a new memory technology aiming to get to commercialized by 2030.

NVIDIA reinforces L4 autonomy dominance as Pony.ai and WeRide unveiled L4 autonomous-driving controllers at the 2026 Beijing Auto Show.

Module Architecture Analysis report of Skyworks SKY520-21 shows integration of LMHB RF for 4G/5G applications, highlighting front-end module consolidation trends.

AMD Ryzen AI Embedded P100 targets embedded and automotive systems with Zen 5 CPUs, RDNA 3.5 graphics, and XDNA 2 NPU.

AI supercomputers and HBM4 face scaling limits as advanced packaging, 3D integration, and supply constraints shape future memory performance.

Q1 2026 smartphones market declines as rising component costs create a divide between winners and losers across the industry.