Samsung Exynos 2400 Advanced Packaging Analysis

This report provides deeper insight on the advanced packaging innovations used in the manufacturing of the Samsung Exynos 2400 processor. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
13Jun

Deep Dive Teardown of the Quectel RG620T-EU Wireless Module

The Quectel RG620T-EU is mainly based on MediaTek solutions, such as the MediaTek MT6990V Quad-Core Applications/Baseband Processor, Power Management (MT6319BP, MT6361LP), GPS Receiver (MT6686MA), supporting GPS, GLONASS, BDS, GALILEO, QZSS and NavIC connectivity, Transceiver (MT6195W). The RF modules are manufactured by Smarter Micro.
12Jun