Micron Technology MT29F2T08ELLLHL4-QA_L 232L 512Gb TLC 3D NAND Flash Memory Floorplan Analysis

Micron Technology MT29F2T08ELLLHL4-QA_L 232L 512Gb TLC 3D NAND Flash Memory Floorplan Analysis

 
Share This Post
 
 

The Micron Technology B57T die is found inside Micron Technology MT29F2T08ELLLHL4-QA_L package. There is one Micron Technology MT29F2T08ELLLHL4-QA_L package in the Micron Technology MTFDKBA256TGE-1BL1AABYY 256 GB 22 × 80 mm M.2 form factor solid-state drive (SSD).

Read the full report

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.