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  1. Home

Latest Blogs and Commentary

Taiwan Earthquake

April 03, 2024

Taiwan Earthquake and the Semiconductor Industry

Discover the aftermath of the Taiwan earthquake on the semiconductor industry and global supply chains. Learn how major players like TSMC are navigating disruptions while prioritizing safety.

Taiwan Earthquake Billion-Dollar Data Center Fallout

April 03, 2024

Taiwan Earthquake: Billion-Dollar Data Center Fallout

A recent earthquake in Taiwan has disrupted industries, including the data center market, raising concerns about supply chain stability.

DRAM Scaling and Maximum Memory Capacity

April 03, 2024

DRAM Scaling and Maximum Memory Capacity

Discover the latest advancements from industry leaders Micron, Samsung, and SK hynix, and gain insights into the future of technology.

2023 Automotive Semiconductor Vendor Share

April 03, 2024

2023 Automotive Semiconductor Vendor Share: STMicroelectronics Closing in on NXP and Infineon

The automotive semiconductor landscape in 2023 showcased Infineon and NXP retaining their top positions, with Infineon widening its lead over NXP.

April 03, 2024

Automotive in-Car Commerce 2024 Update

In-car commerce (also commonly called in-vehicle payments) is one of these more recent features that OEMs have been deploying over the last several years. In-car commerce enables vehicle occupants to pay for fuel, charging, parking, and other services from the infotainment system’s display. As of early 2024, 14 automotive brands offer in-car payment features in 15 countries, with more deployments planned.

Huawei's Q4 2023 Resilience in China Market

April 02, 2024

Huawei's Q4 2023 Resilience in China Market

Despite facing stiff competition from Apple in the mid- to premium-tier segments, Huawei's performance during China's 11.11 online shopping festival solidified its position as a top contender.

April 02, 2024

Automotive Semiconductor Vendor 2023 Market Shares Data

This datasheet presents TechInsights analysis of 2023 automotive sector revenues and market shares of the leading semiconductor vendors, with revenue splits by major component product category and by region including N. America, Europe, Japan, China, South Korea and ROW. It also includes market shares and revenue splits for previous years extending back to 2010.

April 02, 2024

Sony IR Eye Tracking 1.8MP Camera from Apple Vision Pro Package Analysis

The Apple Vision Pro augmented reality headset uses four inferred cameras to track its wearer’s eyes. This report catalogues the structure of those camera modules, how they fit into the headset, and provides an overview of the Sony back-side illuminated CMOS image sensor that they house.

April 02, 2024

OmniVision OX03D4C 1/4" 3MP 2.1μm Pixel CMOS Image Sensor Device Essentials Plus

The OmniVision OX03D4C is a color, 3-megapixel (MP) resolution stacked back-illuminated (BI) CMOS image sensor (CIS) with a 1/4-inch optical format, LED flicker mitigation (LFM), and 140 dB high dynamic range (HDR) for automotive applications.

Micron Q1 2024

April 02, 2024

Micron Q1 2024 (FY Q2 2024) Report Summary

Discover the highlights of Micron's Q1 2024 report, showcasing impressive growth and strategic advancements in the semiconductor industry. Gain insights into Micron's market outlook and innovative initiatives shaping the future of semiconductors.

DRAM IC Sales Up 81% YoY the week ending March 22, 2024

April 02, 2024

DRAM IC Sales Up 81% YoY the week ending March 22, 2024

Semiconductor sales were down 2% last week but increased 19% from this time last year. Zooming in on DRAM IC, the 13-week MA jumped 81% YoY last week.

April 01, 2024

Baidu Kunlun II A2S1CAXGA SoC Packaging Quick Look Analysis

This is an Advanced Packaging Quick Look (APQ) summary document for the Baidu Kunlun Xin A2S1CAXGA processor, provided as a companion deliverable for the APQ-2312-801 project. The Baidu Kunlun Xin processor, also referred to as the Kunlun II, is the second-generation of the Baidu Kunlun processor series.

Renesas, TSMC Embed Fast MRAM

April 01, 2024

Renesas, TSMC Embed Fast MRAM

Renesas and TSMC demonstrated two uses of fast MRAM at ISSCC. Renesas targets faster NVM; TSMC targets working memory. Their tradeoffs are very different.

ST Introduces Its First 64-Bit SoCs

April 01, 2024

ST Introduces Its First 64-Bit SoCs

The STM32MP2 devices integrate up to two Cortex A35 CPUs with a substantial number of I/Os for embedded industrial applications.

April 01, 2024

Survey Plus Teardown of the Xiaomi Redmi Note 13 23129RAA4G Smartphone

The Redmi Note 13 comes with a 120 Hz, 6.67-inch AMOLED touchscreen display offering a resolution of 1080 x 2400. Xiaomi Redmi Note 13 has four cameras.

April 01, 2024

Survey Plus Teardown of the Samsung Galaxy A15 SM-A155M Smartphone

Most of the main SoC in the Samsung Galaxy A15 4G are from Mediatek. In the comparison of the Samsung Galaxy A14 4G it has Octa-Core Helio G99 Applications/Baseband Processor (MT6789V-CD), Power Management (MT6366MW), and RF Transceiver (MT6186MV) chips.

April 01, 2024

Deep Dive Teardown of the Meridian Kia EV6 Audio Amplifier 96370-CV100 Automotive

The Meridian 96370-CV100 is a high-end audio 11 Cannel Amplifier that was designed Meridian Audio. This system is available in the KIA EV6. Communication between the audio amplifier and the audio elements in the car happens through one main connector.

April 01, 2024

Deep Dive Teardown of the Denso Toyota Prius Front Windshield Camera 8646C-47130 Automotive Camera

Designed by Denso, the Vision Sensor Camera is a part of the Toyota Prius safety and driver assistance system. It combines a millimeter-wave radar sensor and vision sensor to assist the driver in safely controlling the vehicle.

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