Latest Blogs and Commentary
Survey Plus Teardown of the Xiaomi Redmi 12 5G 23077RABDC Smartphone
The Xiaomi Redmi 12 5G has a 90 Hz, 6.79” LCD Display with a resolution of 1080 x 2460 pixels. The device operates using Android 13 with MIUI 14.
IoT Connectivity SoC H2 2023 Briefing
IoT Connectivity SoC 2023 H2 Briefing - Wireless technology beyond smartphones: design trends and opportunities with WLAN for smart applications and iIoT/C-IoT.
Automotive Semiconductor Demand Forecast 2021 to 2030 - Q3 2023 Executive Summary
This TechInsights data forecast provides the latest metrics identifying size and growth rate of the future semiconductor demand total across the Powertrain, Body, Chassis, Safety, and Driver Information application domains for the main light vehicle producing regions: North America, Japan, Europe, Russia, South Korea, China, India, Brazil, Thailand and ROW. In 2023, automotive semiconductor is forecast to grow by 23.9%.
No Tricks this Halloween, just Treats from the Backlog
The Chip Insider Graphics
Samsung ISP from the S5KHPXSP, 1/1.4”, 200MP, 0.56μm Pixel Pitch, Back-Illuminated, ISOCELL Tetra2pixel, and Super QPD CMOS Image Sensor Advanced Floorplan Analysis
This report analyzes Samsung HPX as the most recent release of the HP line of image sensors extracted from Xiaomi Redmi Note 12 Pro+ smartphone’s rear-facing wide-angle camera module (former counterparts HP2 and HP3 were found in Samsung galaxy S23 and Honor 80 Pro smartphones’ rear-facing wide-angle camera modules, respectively).
Survey Plus Teardown of the Samsung Galaxy Z Fold5 SM-F946U1 Smartphone
The Galaxy Z Fold5's 120Hz main display and touchscreen likely incorporate a 'Shock Dispersion layer' that is 0.070 mm thick.
Apple A17 Pro (3nm) Transistor Characterization
This report presents key DC electrical characteristics for logic NMOS and PMOS transistors located in the core region of the Apple A17 Pro, APL1V02 application processor. The APL1V02 application processor wasextracted from the Apple iPhone 15 Pro smartphone.
Deep Dive Teardown of the Ring Alarm Security Kit BHABU003 Security System
The Ring Alarm Security System consists of five devices that can be treated separately. The manufacturer provides the option of purchasing each of them individually. This project describes the basic combination of Base Station with separate modules that work with it.
Autonomous Vehicle Start-ups & Small Companies
This database covers the key start-ups and small companies that collectively are playing an important role in the development of autonomous vehicle technology.
Preliminary Global Notebook PC Shipments and Market Share: Q3 2023
Notebook PC shipments declined just 7% in the third quarter of 2023 versus the same period a year ago, the first time the markets' decline has slowed to single-digit percentage points since the first quarter of 2022.
HiSilicon Kirin 9000s GFCV120 SMIC 7nm (N+2) FinFET Process Advanced CMOS Essentials Analysis
The HiSilicon 9000s (Hi36A0 GFCV120) powers the latest flagship, the Mate 60 Pro smartphone released in September 2023, from China-based Huawei, a surprise announcement despite US sanctions.
Deep Dive Teardown of the Samsung Galaxy Z Flip5 SM-F731N Smartphone
Qualcomm has the most design wins for the Samsung Galaxy Z Flip SM-F731N, supplying 14 of the 42 major designs.
Survey Plus Teardown of the Vivo Y27 V2249 Smartphone
The Vivo Y27 features a Tianma display, which is an LCD display known for its competitive price compared to other types of displays on the market.
HiSilicon Kirin 9000s Hi36A0 GFCV120 SMIC 7 nm N+2 FinFET Process Digital Floorplan Analysis
This is a Digital Floorplan Analysis (DFR) of the Hi36A0 GFCV120 die found inside the HiSilicon Kirin 9000S processor.
OpenAI making AI chips? Silicon Supremacy: Who wins?
The Chip Insider®
Sony IMX623, 1/2.42” Format, 2.95MP, 3.0μm Pixel Pitch, Stacked Back-Illuminated (Exmor RS) Split Pixel Technology HDR and LFM CMOS Image Sensor Device Essentials Folder
This device essentials folder (DEF) presents the Sony IMX623, 1/2.42” Format, 2.95 MP, 3.0 µm Pixel Pitch, Stacked Back-Illuminated (Exmor RS) Split Pixel Technology HDR and LFM CMOS Image Sensor for Automotive Applications.
Automotive Semiconductor Demand Forecast 2021 to 2030 - October 2023
This TechInsights data forecast provides the latest metrics identifying size and growth rate of the future semiconductor demand total across the Powertrain, Body, Chassis, Safety, and Driver Information application domains for the main light vehicle producing regions: North America, Japan, Europe, Russia, South Korea, China, India, Brazil, Thailand, and rest of the world.
