Latest Blogs and Commentary
Renesas R7F702301BEBBA-C_BC6 TSMC 28nm Embedded Flash Advanced Memory Essentials
This report provides insight on the structure and materials used in the manufacture of the Renesas R7F702301BEBBA-C_BC6 microcontroller comprising a die fabricated using TSMC 28 nm HPL HKMG CMOS process with embedded flash (eFlasH). The report includes a summary of key findings, and a detailed look at the eFlash array and peripheral structures and materials used. SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
SK Hynix Hi-5022Q, 1/2.8″ Format, 50MP Resolution, 0.64μm Pixel Pitch, Stacked Back-Illuminated CMOS Image Sensor Device Essentials Folder
The SK Hynix’s Hi-5022Q is a color, 1/2.8” optical format, high quality 50 MP stacked back-illuminated CMOS image sensor (CIS) with a 0.64 μm pixel pitch for mobile phone camera applications. This CIS was extracted from the 8849 TANK 3 phone rear/front-facing camera.
Deep Dive Teardown of the Samsung Galaxy A05 SM-A055F/DS Smartphone
MediaTek and Lansus have the most design wins for the Samsung Galaxy A05. The Application/Baseband Processor and power management with audio CODEC were from MediaTek. MediaTek (MT6769V/CZ) Octa-Core Helio G85 Applications/Baseband Processor also is used in another budget smartphones for the Asia market, like Vivo Y27 (V2249) and Xiaomi Redmi 12 (23053RN02A).
Automotive Semiconductor TAM by Sector by Domain
This market forecast report shows that Economy Vehicles are now the fastest growing vehicle sector for automotive semiconductor demand, with a dollar CAAGR of 12% expected over 2023 to 2028. This report now also includes data for semiconductor sensors.
Automotive Semiconductor TAM by Powertrain Type by Domain
This market forecast report shows that battery electric vehicles are expected to be the fastest growing vehicle type for automotive semiconductor demand, with a CAAGR of 26% expected over 2023 to 2028.
Automotive Semiconductor TAM by OEM Group by Domain
This market forecast report shows that Jianghuai Automotive is expected to be the fastest growing vehicle OEM for automotive semiconductor demand, with a dollar CAAGR of 18% expected over 2023 to 2028. This update has added in unit data alongside the existing dollar data. It also now includes data for semiconductor sensors.
East Europe xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - January 2024
This TechInsights data model presents a view of the East Europe outlook for xEV systems and associated semiconductor and sensor demand. Despite the uncertainties and challenges posed by the Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles in particular is not slowing down with volume demand continuing to grow.
China xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - January 2024
This TechInsights data model presents a view of the China outlook for xEV systems and associated semiconductor and sensor demand. Despite the uncertainties and challenges posed by the Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles in particular is not slowing down with volume demand continuing to grow.
Brazil xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - January 2024
This TechInsights data model presents a view of the Brazil outlook for xEV systems and associated semiconductor and sensor demand. The market remains at an early stage with a primary emphasis towards hybrid platforms. Deployment of battery electric vehicles remains at an early stage with combined volumes still expected to be lower than for hybrid platforms.
Global xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - January 2024
This TechInsights data model presents a view of the Global outlook for xEV systems and associated semiconductor and sensor demand. Despite the uncertainties and challenges posed by the Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles, in particular, is not slowing down with volume demand continuing to grow.
Infineon CYPD7271-68LQXQ Dual-Port USB-C Power Delivery and DC-DC Controller PMIC Essentials
This report presents a power essentials analysis of the Infineon CYPD7271-68LQXQ that belongs to the CCG7DC family of highly integrated dual-port USB-C power delivery solutions with integrated buck-boost controllers. Near the logic region, two memory blocks, potentially ROM or SRAM, are identified. Additionally, an extra flash memory block is observed, utilizing Infineon's embedded nonvolatile memory technology.
Automotive Video Series Part 4: Post-Show Reflections - Unpacking CES 2024 for Automotive
Hear the analysts reflect on the accuracy of their predictions, their most surprising discoveries, and the implications of all the groundbreaking announcements for the upcoming year.
Automotive Semiconductor Demand Forecast 2021 to 2030 - January 2024
This TechInsights data forecast provides the latest metrics identifying the size and growth rate of the future semiconductor demand totals across the Powertrain, Body, Chassis, Safety, and Driver Information application domains for the main light vehicle producing regions: North America, Japan, Europe, Russia, South Korea, China, India, Brazil, Thailand, and rest of the world.
Deep Dive Teardown of the Samsung Galaxy S23 FE SM-711B/DS Smartphone
Samsung has the most design wins for the Samsung Galaxy S23 FE with twelve major ICs. Samsung provided the Octa-Core Applications/Baseband Processor developed with 5 nm CMOS technology.
On-Device AI Race to Catch NVIDIA Dominates Computing World
In our full report on computing at CES, we explore the different approaches to AI by industry players, the real-world implications of AI, and other computing products and solutions that surprised us by their presence or lack thereof at the show.
Survey Plus Teardown of the Vivo X100 V2309A Smartphone
MediaTek has provided thirteen chips for the Vivo X100 V2309A. It supplied the Dimensity9300 Applications/Baseband Processor, Power Management and Audio CODEC, 6x Power Management, RF Transceiver, WiFi7/Bluetooth SoC, 2x Envelope Power Tracker, and GPS Receiver.
Deep Dive Teardown of the Weltmeister Automotive Development Platform SA8155P Automotive
Weltmeister is a Chinese manufacturer of electric SUVs and passenger cars. Formerly known as VM Motor. The proper operation of all subsystems is managed by the SA8155P Automotive Development Platform created by them.
Analysis: CES 2024 – On-Device AI Race to Catch NVIDIA Dominates Computing World
TechInsights was on the ground at CES 2024, and AI was the driving theme throughout the week. In this report, we explore the different approaches to AI by industry players, the real-world implications of AI, and other computing products and solutions that surprised us by their presence or lack thereof at the show.
