NIO, the Chinese electric vehicle manufacturer, recently tested its new semi-solid-state batteries during a 14-hour, 650-mile journey with CEO William Li driving the ET7 sedan. These batteries, developed by Chinese company WELION, boast a 150-kWh capacity, promising extended range and faster charging times.

The electric vehicle (EV) market is rapidly expanding, with millions of new electric cars registered globally, bringing the total on the roads to tens of millions.

In our series on Apple Vision Pro, we now focus on the headset's eye tracking system. This advanced technology allows users to control the interface with their gaze, replacing traditional input methods like a mouse or trackpad.

TDK CeraCharge™ - the First Rechargeable all-Ceramic SMD Battery Discover the advancements in IoT power sources with TDK CeraCharge™, the first rechargeable all-ceramic solid-state SMT battery. Learn about its innovative materials, performance capabilities, and the challenges of battery pack design

Chiplets moving into the Fast Lane: Transforming Automotive Processors Discover how chiplet technology is transforming the automotive industry, offering higher yields, faster development, and reduced costs. TechInsights predicts significant chiplet adoption by 2030, driven by evolving vehicle

Discover how the smart home device market is set to exceed 2.5 billion shipments by 2030. Learn about the key drivers, regional insights, and strategic opportunities that will shape the future of smart home technology.

Join us as TechInsights’ Sustainability Team discusses these key issues facing the semiconductor industry in 2024 and beyond.

Discover the latest Hybrid Bonding technology with the KIOXIA/WD BiCS8 CBA 3D TLC NAND. Analyzed by TechInsights, this innovative device showcases an advanced edge-XDEC floor plan and a sophisticated 2-deck integration.

Initial SEM results confirm Samsung’s 2nd generation 3nm GAA technology in the Exynos W1000 processor. Discover key insights and implications for high-volume manufacturing requirements in our latest analysis on the TechInsights Platform.

Topics covered include TSMC’s recent announcements of an expanded technology offering for system-on-wafer (SoW) and new targets supporting continued interposer scaling in 2.5D chip-on-wafer-on-substrate (CoWoS) technology that is underpinning the AI boom.