Latest Blogs and Commentary
Qualcomm HB07D ultraBAW SMR die (QPM6670-000) Acoustic Wave Filter Report
Explore our in-depth analysis of Qualcomm’s SMR ultraBAW filter die HB07D, featuring TDK's Thin Film Acoustic Package (TFAP). Essential insights for RF filter designers, manufacturers, and the RF IC supply chain.
Analysis: An Intelligent Apple A Day
Discover the key AI features unveiled at Apple’s iPhone 16 launch event and how they could impact the company’s financial future. Explore our analysis of Apple's AI integration and commitment to privacy and security.
Qorvo EG9178 SMR Filter die (QM77180) Acoustic Wave Filter Report
Get in-depth insights on Qorvo’s SMR filter die EG9178 with structural, material, and architectural analysis.
Apple Vision Pro Utiizes SK hynix DRAM in R1 Chip
Discover how the SK hynix H5EA1A56MWA 1 Gb LLW DRAM enhances real-time processing and low-latency performance in the Apple Vision Pro AR headset with advanced memory architecture.
Apple AirPods Pro Disrupts Hearing Aid Market
Apple's AirPods Pro is set to disrupt the $12B hearing aid market with FDA-approved features and cutting-edge tech. Explore TechInsights' reports for a detailed breakdown of the tech driving this innovation.
Will Silicon-Based Anode Technology Take the Crown as the Future of High-Energy-Density Lithium Batteries?
The most used anode material for LIBs is graphite which has a specific capacity of 372 milliampere hours per gram (mAh/g). However, the energy density of LIBs can be improved with the incorporation of Silicon (Si) instead of graphite.
Infineon CYW89570 AIROC Wi-Fi 6E/BT 5.3 LE Automotive SoC Floorplan Analysis
Discover the Infineon BT55909YA0 die in CYW89570 and Murata LBEE5XV2EA-802, and its role as an RF transceiver for mobile connectivity.
Samsung S5M6551 Wi-Fi 6/BT 5.4 Combo SoC Floorplan Analysis
Read our latest analysis of the Samsung S5M6551X02 die, extracted from the Galaxy Watch7, and explore its role as an RF transceiver for IoT connectivity.
YMTC’s New Xtacking4.0: YMTC found the solution to overcome the US ban?
Discover TechInsights' findings on YMTC's new Xtacking4.0 chip from the ZhiTai TiPlus7100 Black Myth SSD. Explore the 160L stacking layers, hybrid-bonded structure, and advancements in the 512 Gb Xtacking4.0 160L TLC chip (Gen5). Has YMTC overcome the US ban?
Brief View the YMTC Xtacking4.0 Technology: What’s new on the chip?
Discover the key differences between YMTC Xtacking4.0 (Gen5) and previous generations. Explore TechInsights' in-depth analysis of structure, process, and design advancements from Gen1 to Gen5 in 3D NAND technology, highlighting cutting-edge innovations in storage density, speed, and energy efficiency.
Using TechInsights to understand inflection points when new toolsets will be adopted
Explore how a leading DRAM equipment manufacturer drives innovation by providing cutting-edge solutions that enable the production of advanced DRAM devices and smaller technology nodes.
Using TechInsights' Mobile RF product to track design trends and gain a competitive advantage in mobile radio design
Learn how a market leader in 5G mobile platforms uses competitive benchmarking to identify growth opportunities and maintain an edge in the smartphone OEM market.
Using TechInsights Bill of Materials (BOM) Database to Achieve Substantial Savings
Discover how a leading foundry leverages TechInsights' expertise to navigate diverse customer needs, focusing on mainstream semiconductor technologies and strategic growth.
SmartSens SC100AT Standard Floorplan Analysis
Explore the in-depth analysis of the SmartSens SC100AT image sensor die, featuring 1.3 MP resolution and a 3.0 µm pixel pitch for automotive applications. This report includes foundry identification, key features, SEM cross-sections of periphery circuits, die functional floorplan, and cost details.
YMTC Xtacking4.0: Breaking New Ground in 3D NAND Technology
Explore the latest advancements in YMTC's Xtacking4.0 (Gen5) 3D NAND technology, including innovations in storage density, speed, and efficiency. Discover how it compares to previous generations.
2024 Compute – SoC Design Video Briefing 2
Join TechInsights’ upcoming SoC Design Analysis video briefing featuring TSMC, Samsung and Intel latest technology nodes, TSMC N3E, Samsung SF3 and Intel 4nm, through the lens of digital gates and standard cell libraries.
Tenstorrent Wormhole Upgrades Memory
Read our latest report on Tenstorrent's Wormhole architecture, covering the n150 and n300 PCIe boards, memory enhancements, performance boosts, and power efficiency. Discover how these innovations are influencing the AI-chip market and what lies ahead.
YMTC's Memory Developments Highlight China's Strong Position
YTMC’s latest Xtacking4.0 process has been observed in a new memory chip from the Chinese vendor. What can it tell us about the development of the domestic Chinese semiconductor industry in the face of US sanctions?
