Latest Blogs and Commentary
Renesas Presses MCU Performance Lead
With the expansion of the RA8 series, Renesas is integrating Arm’s highest-performing Cortex-M CPU in microcontrollers optimized for graphics display and motor control applications.
Analysis: Apple iPad Model Tracker Q4 2023 – Expect Big Changes in 2024 as Apple Refreshes the iPad
As economic conditions improved in the second half of 2023, so too did tablet demand. However, with a product portfolio not updated since late 2022, low refresh demand for iPad held back a stronger recovery.
NVIDIA Goes All In on Generative AI
NVIDIA's latest unveilings represent a significant leap forward in technological innovation across various domains. The introduction of the Blackwell GPU, while lacking specific performance metrics, hints at enhanced capabilities, especially with its integration into the DRIVE THOR SoC.
Intel SRMZ1 Core Ultra 7 8PNRC (SoC Tile) TSMC 6nm FinFET Digital Floorplan Quick Look
The SRMZ1 is a 3D packaging assembly comprising a side-by-side arrangement of four dies, including system-on-chip (SoC) die with die makings 8PNRC, mounted on a common interposer placed on the package wiring board (PWB) employing Intel’s 3D Performance Hybrid Architecture packaging technology. SRMZ1 application processor was extracted from the Acer 14" Swift Go 14 multi-touch laptop.
Survey Plus Teardown of the Samsung S24 Ultra SM-S928B/DS
The Samsung Galaxy S24 Ultra comes with a custom version of Qualcomm's high-end chipset - Snapdragon 8 Gen 3. This phone has a 5,000mAh battery with support for 45W fast charging. The SIM card tray can handle two nano-SIM cards.
Data-Center AI Chip Market 2023 Year-End and Q4 2023 Update
This document summarizes quarterly update (Q4/23) from companies like DC AI Chips, Nvidia, Intel and AMD, and key yearly updates (2023) for the data center AI chip market.
Samsung Unveils First Imager Featuring Hybrid Bond Technology
Unlock the future of imaging technology with TechInsights' groundbreaking discovery: Samsung's inaugural imager boasting innovative hybrid bond technology.
China: Smartphone Shipments & Marketshare by Model: Q4 2023
China is the world's largest smartphone market. It delivers high volume and revenue to device makers, component suppliers and operators. Our extensive report shows the top-100 best-selling smartphone models in China in the fourth quarter of 2023. Besides popular Apple, Honor, Oppo, Vivo, and Xiaomi models, which brands and models have made their way into the bestsellers and what is the secret behind their success?
Germany Handset Vendor Marketshare by Operator: Q4 2023
We estimate 6.2 million handsets were shipped in Germany in Q4 2023, declining by -2% YoY during the quarter. Apple captured the leading positions across all major carriers in Germany ahead of Samsung. Xiaomi maintained its standing while Oppo lost the ground due to patent issues. vivo and Realme as well as Oppo shipped no new smartphones during the quarter.
Smartphone Vendor Marketshare for 'Next 60' Countries: Q4 2023
Global smartphone shipments grew by 7% annually YoY in Q4 2023. The sixty countries tracked in this report accounted for 91% of these global shipments. Apple was the largest vendor and was followed by Samsung on consolidated shipments to these markets.
AI-Capable Notebook PC Shipments Forecast by Region and OS 2023-2029: 1Q 24
AI-capable notebook PCs - defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) – will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.
Prophesee GenX320ES Event-Based Metavision Sensor Mixed Signal ISP Die Advanced Floorplan Analysis
This report presents an advanced floorplan analysis of the image signal processor (ISP) die from the Prophesee GenX320ES, 1/5″ format, 320 ×320 pixels resolution, 6.3 μm pixel pitch, stacked back-illuminated event-based Metavision® CMOS image sensor for embedded vision and power-sensitive applications.
Beken BK3296 22nm Bluetooth Audio SoC Process Analysis
This report provides an analysis of the structure and materials used in the manufacture of Beken BK3296 22nm Bluetooth Audio SoC manufactured in UMC's 22nm ULP process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
3D NAND Technology Roadmap
Gain exclusive access to TechInsights' comprehensive 3D NAND Technology Roadmap, guiding you through the ever-evolving landscape of innovation.
Maximizing NAND Capacity per Wafer in 3D NAND Production
Stay ahead in the dynamic world of semiconductor technology with insights into the race for maximum NAND capacity per wafer in 3D NAND production. Discover how advancements are driving innovation, pushing boundaries, and shaping the future of storage.
Deep Dive Teardown of the OnePlus Open CPH2551 Smartphone
Power Management (PM8550VE-001, PM8550VS-001, and PM8550-001) used in Samsung version S24 Ultra, which indicates the use of the same chipset as flagships smartphones. ICs from Skyworks, Qualcomm and Murata provide RF chips for smartphones. Of the new RF chips, the most notable is the LB Front-End Module (SKY58101-11). OnePlus has WiFi 7 and Bluetooth 5.3, for this used Qualcomm IC (WCN7851-101).
Deep Dive Teardown of the Samsung Galaxy S24 SM-S921B/DS Smartphone
The manufacturer with the main cost is Samsung. It supplied the Applications/Baseband Processor, DDR5X SDRAM, 3D TLC V-NAND Flash, RF Transceiver + GPS, NFC Controller, 8x Power Management, Camera Power Management, 3x Envelope Power Tracker, and Clock Buffer. Samsung supplied a total of 18 chips for this device.
Accelerating Automotive Innovation with AI
Discover the groundbreaking Blackwell chip, promising accelerated advancements in autonomous driving and electric vehicles with its impressive performance improvements.