Latest Blogs and Commentary
Global Handset Sales Forecast by 88 Countries and 19 Technologies up to 2029
Discover our in-depth report on global handset sales, forecasting trends for 6 regions and 88 countries through 2029. It covers the rise of 5G, the decline of LTE, and forecasts for 19 technologies with detailed data for analysis.
SmartSens SC535HGS (3rd Gen Global Shutter) Device Essentials Folder
Explore the SmartSens SC535HGS 4.0 MP CMOS image sensor, featuring VDGS and SmartGS®-2 Plus technology for enhanced low-light performance and up to 78dB dynamic range.
TSMC’s Embedded Resistive Random-access Memory (eReRAM) Technology
Explore TechInsights' latest reports on TSMC-fabricated eReRAM devices, showcasing cutting-edge memory technology and integration methods.
Antenna-in-Package (AiP) Technology for 5G and beyond: A Comparative Analysis of Advanced Modules from Flagship Devices (Qualcomm, Murata, USI, MediaTek)
Discover the latest in Antenna-in-Package (AiP) technology for 5G and beyond. This report compares advanced AiP modules from Qualcomm, Murata, USI, and MediaTek, showcasing innovations in wireless packaging.
Unlocking Cost Efficiency and Capacity Forecasting
Discover the challenges procurement managers face in accurately assessing foundry costs and forecasting future production capacity for critical node expansions.
A First Look at Infineon’s and Industry’s First 400 V SiC MOSFET
TechInsights is excited to announce that we have Infineon’s, and the industry’s, first 400 V silicon carbide (SiC) MOSFET in-house.
2025 Memory Outlook Report
Discover the key trends shaping the memory market in 2025, including AI impacts on HBM and NAND growth. Stay informed with essential insights and forecasts.
2025 Advanced Packaging Outlook Report
Discover key insights from the Advanced Packaging Outlook Report 2025, covering trends like interposers for AI, Panel-Level Packaging (PLP), automotive chiplets, silicon photonics, and glass substrates, driving the future of semiconductor packaging.
Apple MacBook Air (A3113) Teardown
Explore the Apple MacBook Air (A3113), 13 inch teardown, uncovering key components like the M3 processor, WiFi 6E, camera subsystem, and a cost-effective yet premium design.
Zentel PSMC 25 nm 4 Gb DDR4 DRAM Advanced Memory Essentials
Unlock critical insights into Zentel PSMC A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM with our Advanced Memory Essentials (AME) report. Includes TEM-EDS, TEM-EELS results, key device metrics, and detailed SEM/TEM imaging. Perfect for semiconductor memory analysis.
Highlights from European Microwave Week
Explore the key highlights from last week's European Microwave Week in Paris. Over 4,000 attendees, 300 exhibitors, and three major conferences covered the latest in RF and microwave technology, with workshops and forums on automotive, 6G, and Aerospace & Defense.
Samsung Shannon 5730 FR2 IF Transceiver Die Floorplan Analysis
Explore insights on the Samsung Shannon 5730 die, found in the FR2 IF transceiver from the Google Pixel 9 smartphone.
YMTC 160L 512Gb TLC 3D NAND - Xtacking 4.0 Floorplan Analysis
Explore this comprehensive report analyzing the floorplan design of the YMTC 160L TLC 3D NAND – Xtacking 4.0. It includes detailed imaging sets, process node identification, and die/package cost analysis.
The Impact of Standard Cell Width on Future Innovation
Module two dives into logic scaling by focusing on standard cell width, setting the foundation with a recap of module one.
Hurricane Helene Disrupts Access to the World’s most Critical Quartz Mine
Discover how Hurricane Helene's disruption of North Carolina's critical quartz mines may impact the semiconductor supply chain, sourcing strategies, and market trends.
Tracker: China Smartphone Shipments & Marketshare by Model: Q2 2024
Uncover the top 100 best-selling smartphone models in China for Q2 2024. Explore the success behind leading brands like Apple, Honor, Oppo, Vivo, Xiaomi, and more in the world’s largest smartphone market.
STMicroelectronics VG1762 Device Essentials Folder
Discover the in-depth analysis of STMicroelectronics’ VG1762 CMOS image sensor (CIS) with 2.3 MP resolution and 1/2.5” optical format. Learn about its high dynamic range (HDR), ultra low-noise performance, and NIR optimization.
Movellus Offers Core-level Dynamic Voltage Scaling
Movellus’s licensable Aeonic Power on-die voltage regulator technology enables dynamic voltage scaling circuity to be integrated in silicon at a core level, enabling fine-grained power control and the creation of virtual power islands around individual cores on the same chip.