Latest Blogs and Commentary
Introducing TSMC N3E As Seen In Apple M4 SoC
TechInsights shares preliminary results of the Apple M4 analysis on design blocks like GPU and CPU, featuring 2-1 finFLEX and 3-2 finFLEX libraries, respectively. Dive into our on-going analysis and discover the measurements of critical dimensions of TSMC’s 3nm 2nd generation process node: the N3E technology node.
Qualcomm Snapdragon 8 Gen 3 Digital Floorplan Analysis
The Qualcomm Snapdragon 8 Gen3 (SM8650) application processor found in the Xiaomi 14 Pro 5G handset, features a CPU cluster composed of eight cores - this time swapping some efficient CPU cores for more powerful mid-size cores (vs the Snapdragon 8 Gen2).
SEC Court Challenge Sidetracks Emissions Reporting Requirements
Unveiling a full picture of a semiconductor's carbon footprint requires a deep dive into the supply chain.
2024 Power Essentials Video Briefing 1
In this briefing, we capture market headlines from the previous months, including acquisitions and investments, major supply chain agreements, collaboration agreements, facility and capability expansions, and updates on the new and on-going patent litigations between Infineon and Innoscience, as well as EPC and Innoscience, respectively.
H1 2024 Wi-Fi/IoT Briefing
Complete with links to relevant Wi-Fi/IoT device reports from the TechInsights Platform, this Analysts’ Briefing is the essential companion the subscribers to discover the challenges and advancements in today’s mobile wireless connectivity outside the cellular domain.
Smartphone Image Sensor Market Share Q1 2024: Demand Drives Volume Growth
The smartphone image sensor market experienced a growth of 5% in Q1 2024. The recovery in the end-market boosted the orders of high-resolution CIS products to meet the smartphone specification demand.
Smartphone Image Sensor Shipments by CIS Model with Specifications: Q1 2024
The global smartphone image sensor market registered over 7% unit growth in Q1 2024. The growth was supported by the revival in market demand, driving the stocking of CIS for customer's new smartphone products. GalaxyCore GC02M1 series dominated shipments followed Samsung S5KJN1 series and Sony IMX714 series, together claiming over 180 million units shipped during the quarter.
Forecast: Automotive Semiconductor and Sensor Demand
This global forecast covers historical and future semiconductor and sensor demand for the automotive industry in USD and units. In 2024, automotive semiconductor demand is forecast to grow by 13% in USD to reach $80 billion; unit growth is expected at 7% surpassing 113 billion.
Survey Plus Teardown of the Tecno Spark Go 2024 BG6 Smartphone
The Tecno Spark Go 2024 BG6 is one of the latest Tecno smartphones. This device is one of the latest variants from Tecno Spark Go line and the successor to the Tecno Spark Go 2023.
The Chip Insider®– How Japan Lost its Semiconductor Industry
In all the discussions around China’s effort to gain leadership in semiconductors, the question of how Japan lost its position – with such a huge advantage – keeps coming up. In the end, there were six strategic causes behind the long-term failure of Japan’s semiconductor industry.
China's Semiconductor Production Capacity to Grow by 40% in Five Years
Gain insights into China's semiconductor industry with TechInsights, foreseeing a 40% capacity growth over five years, driven by equipment purchases and strategic investments, shaping global markets and trade policies.
Deep Dive Teardown of the Amazon Echo Show 8 3rd Gen R855D6 Smart Display
The design wins for the Amazon Echo Show 8 3rd Gen is divided between different manufacturers. The application processor comes from Amlogic while WiFi Front-end comes from Mediatek. As for the memory, SK Hynix provided 2 GB LPDDR4 SDRAM and Samsung provided 8 GB MLC NAND flash.
Advanced TSMC 22ULL Embedded RRAM Chip Unveiled
Discover the advanced TSMC 22ULL embedded Resistive RAM (eRRAM) chip featured in Nordic Semiconductor's latest nRF54L SoC devices.
GalaxyCore GC32E1 Standard Floorplan Analysis
The ISP from the periphery region of the Galaxycore GC32E1, a back-illuminated (BI) CMOS Image Sensor (CIS) for mobile cameras, was extracted from the Tecno Spark 20 front camera.
Canon LI5030SAC Device Essentials Folder
The Canon LI5030SAC is a Bayer color, 6.4 μm, front-illuminated (FI) charge domain global shutter (GS) full frame (FF) CIS for machine vision applications, acquired as a standalone part.
Survey Plus Teardown of the Samsung A35 5G SM-A356E/DS Smartphone
The Samsung A35 5G is equipped with the Samsung Exynos 1380 processor, while its predecessor, the Samsung A34, offers the Mediatek Dimensity 1080. The Samsung A35 5G offers 6, 8, and 12 GB of RAM, while the Samsung A34 5G can be equipped with 4, 6, or 8 GB RAM.
Q1 2024: Honor: Topped China and Solid Progress in Overseas Market
Driven by the growth in both overseas and China market, Honor’s global smartphone shipment increased 34% YoY to 17.0 million units. It also took the leadership in China this quarter. Solid progress in overseas markets has been made with record higher contribution this quarter since the split from Huawei. Despite a slight fall on average selling price (ASP), Honor posted significant annual revenue growth in Q1 2024.
A Tale of Two Foundries (TSMC and HLMC) and One Design House (HiSilicon)
Explore HiSilicon's Hi1105-GFCV100 module and its manufacturing journey between TSMC and HLMC foundries, highlighting the design consistency and adaptability in the semiconductor industry amidst global chip shortages.
