Latest Blogs and Commentary
Global Smartphone Vendor ASP and Revenue Share by region: Q1 2024
Global Wholesale Smartphone Revenues grew by 1% annually to US$100.1 Bn in Q1 2024. Apple, Samsung and Xiaomi were the top three vendors and together accounted for over 70% of the smartphone revenues. Apple led on revenue in five of the six regions, while on ASP’s it led in all the six regions tracked here. Asia pacific remained the largest region by revenues and shipments in Q1 2024.
OECD Mobile Voice and Data Price Benchmarking Q2 2024
The Q2 2024 update of the OECD Mobile Voice and Data Price Benchmarking service is now available for download and includes over 2,100 mobile voice and data tariff plans from 76 providers across 38 OECD countries. The OECD Mobile Voice and Data Price Benchmarking Service uses the OECD 2017 baskets.
BYD and CATL Duel for 6C Charging Dominance
In recent weeks, the two leading producers of EV batteries in the world, CATL (Contemporary Amperex Technology Co Ltd) and BYD, both announced plans to release 6C charging batteries to the market. The advent of 6C batteries has been touted for a while and was the inevitable next awaited step in fast-charging battery technologies.
2022 Renault Megane E-Tech Head Unit Deep Dive Teardown
The LANR21 is a head unit designed for Renault, Nissan, and Infinity cars. The version analyzed in this report (NSRNCNAG1A1) was sourced from a 2022 Renault Megane E-Tech. It features Bluetooth 5.1, WiFi 5, and USB connectivity, runs Android 10, and supports Android Auto and Apple CarPlay.
Oppo A60 (CPH2631) Survey Plus Teardown
Oppo A60 is a low-range smartphone for Emerging Asia markets. Designed with Qualcomm Snapdragon 680 platform, 5000 mAh battery including 45W SUPERVOOC, 50MP/2MP rear camera and 8 MP front camera, 6.67 inch 1604x720 pixel display.
Sustainable Semiconductor Manufacturing: A Mid-Year Roundup of 2024 Top Developments
Explore the top five sustainable semiconductor developments of 2024, highlighting how industry leaders are innovating to meet environmental, consumer, and investor demands.
KIOXIA/WD BiCS8 218L CBA 3D TLC NAND
Discover the latest Hybrid Bonding technology with the KIOXIA/WD BiCS8 CBA 3D TLC NAND. Analyzed by TechInsights, this innovative device showcases an advanced edge-XDEC floor plan and a sophisticated 2-deck integration.
Chinese EV Makers Expanding into Eastern Europe to Bypass EU Tariffs
Chinese EV exports declined 13.2% in June, marking a third consecutive monthly drop due to new trade barriers from the US and EU. In response, BYD plans to invest $1 billion in a Turkish factory to bypass EU tariffs, with production starting by late 2026. This facility, along with a new factory in Hungary, highlights BYD's strategy to navigate regulatory challenges and sustain its European market presence.
3D NAND – Recent QLC
A comparison of the recently analyzed 1YY-L quad-level cell (QLC) 3D NANDs (Samsung V7 QLC, KIOXIA/WD BiCS6 QLC, Micron Gen5 QLC and Solidigm Gen5 QLC) with YMTC Gen4 QLC 3D NAND is presented. In addition, projection of KIOXIA/WD QLC to achieve bit density of 100 Gb/mm2 for one thousand layers 3D NAND is made.
Nordic nRF52840 Multiprotocol BT 5.4 LE Sidewalk SoC Floorplan Analysis
The Nordic TMJD13 die was found inside the Nordic nRF52840 component. The nRF52840 component was extracted from the RAKwireless RAK4630 LoRa Bluetooth module. The nRF52840 component is positioned as a multiprotocol RF transceiver for wireless connectivity.
Apple iPad Pro 13" A2926 Deep Dive Teardown
Apple iPad Pro 13" is Apple's thinnest product ever at 5.1mm. It is available for both Wi-Fi/Cellular connectivity. It is designed with the new Apple M4 chip APL1206 Application Processor and Qualcomm SDX70M Baseband Processor, 13" XDR display 2752x2064 pixels, front and rear 12MP cameras.
Samsung SF3 (2nd Gen 3nm GAA) in Exynos W1000 Processor Confirmed
Initial SEM results confirm Samsung’s 2nd generation 3nm GAA technology in the Exynos W1000 processor. Discover key insights and implications for high-volume manufacturing requirements in our latest analysis on the TechInsights Platform.
The Chip Insider®– If Trump wins election: The bill for Chip Makers
In this blog, we discuss the potential impact on the semiconductor industry if Trump wins the election, including concerns about U.S. direct investment requirements for foreign chip makers, and Samsung's delay of their Taylor, TX fab following the $6.4 billion CHIPS Act subsidy announcement.
Intel Drops Hyperthreading From New CPU
Intel’s Lion Cove contains significant departures from previous CPU microarchitectures, prioritizing performance efficiency by omitting hyperthreading and other performance-boosting innovations but still manages to deliver a double-digit IPC uplift.
Microprocessor Report June 2024 Review
Microsoft’s Copilot+ PC demands saw Qualcomm, Intel and AMD all launch new PC SoCs with advanced NPUs. Intel’s Gaudi 3 will compete with NVIDIA—although only NVIDIA’s previous generation H100. Advanced packaging is a significant industry trend, and AR is a driving force behind new packaging technologies from TSMC seen in the Apple R1, and an experimental SoC from Meta.
Samsung Exynos W1000 Wearable Processor Samsung SF3 GAA Process – Release 1
This report provides a preliminary analysis of the structure and materials used in the manufacture of of the Samsung Exynos W1000 wearable processor die, fabricated using the SF3 process, Samsung’s second-generation (gate-all-around) GAA process.
AI's Influence on Advanced Packaging: Mid-Year Briefing Highlights and Innovations
Topics covered include TSMC’s recent announcements of an expanded technology offering for system-on-wafer (SoW) and new targets supporting continued interposer scaling in 2.5D chip-on-wafer-on-substrate (CoWoS) technology that is underpinning the AI boom.
HP Omen 16 (2023) (7N9X4UA_ABA) Deep Dive Teardown
HP Omen 16 2023 laptop is released specially for gaming applications, powered by AMD Rayzen 7840H processor and NVIDIA GeForce RTX 40 series graphics processor. Laptop designed with Wi-Fi 6e/Bluetooth 5.3 and 2TB PCIe Gen 4 Samsung SSD.
