The Amazon Alexa Echo Hub G6A87E is an Alexa controlled device with a display/touchscreen, four microphones, and two speakers. The speakers are located at the top of the device. The Amazon Alexa Echo Hub G6A87E has 2 GB LPDDR4 SDRAM, 8 GB MLC NAND Flash Memory and the 64-Bit Hexa-Core application processor from MediaTek.

Efficient Power Conversion (EPC)’s EPC2619 E-Mode Sixth Generation GaN HEMT boasts improved device performance over EPC’s previous generation device and shows very competitive figures compared to other 100 V GaN HEMT devices. This blog discusses processing techniques and structures observed that can contribute to the device performance boost.

This report provides an insight into the structure of the OmniVision OX08D10 CMOS image sensor ISP die for automotive applications. The analysis provides foundry identification and a summary of the salient features observed that is accompanied by a set of SEM cross-section of the ISP die.

TechInsights forecasts xEV production to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. Semiconductor demand from xEV powertrain systems is forecast to grow at a CAAGR of 15% from $10.5 billion in 2023 to almost $21.4 billion in 2028 and reaching $25.6 billion by 2031.

TechInsights predicts the server market will reach $273b by 2028, growing at a CAGR of 18%. Unlike recent years where server demand has been cyclical in nature and effected by the ebb and flow of refresh cycles, now a disruptive influence is stimulating growth: artificial intelligence.

Renesas launched its R-Car Open Access (RoX) development platform for software-defined vehicles (SDVs). Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the aim is to help Renesas’ OEM and Tier 1 customers to “shift left” their respective developments of software defined vehicle (SDV) platforms that will be underscored by the move towards battery electric vehicles (BEVs).

The global smartphone memory market experienced over 50 percent revenue growth in Q1 2024. The annual growth was backed by the recovery in pricing and inventory build-up demand from major smartphone customers. Samsung recorded 49 percent revenue share followed by SK Hynix and Micron in Q1 2024. This report covers the global shipments, revenue, and ASP of NAND Flash and DRAM Memory chip products by vendor, by technology and by quarter from CY2018Q1 to CY2024Q1.

Huawei leads the foldable markets in Q1 2024. Huawei is at the peak position in both shipments and revenues. Huawei in on route to become the largest foldable vendor. Asia-Pacific is a growth leader in foldable-display smartphone shipments.

Samsung's share is eroding and it will lose peak position in 2024 to Huawei. We forecast Samsung will retain second place globally still in 2025 followed by Honor taking third position.

This report provides an overview into the structure of the OmniVision OX08D10 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed, and is accompanied by a set of optical, SEM cross-section, and bevel images of both CIS and ISP dies.

The PCB design of the Huawei Pura 70 Pro (HBN-AL00) consists of eleven substrates but only two of them (Main Board and RF Board) are mostly used for RF communication. Most of the cellular communication is situated on the first side of the RF Board while the whole non-cellular (WiFi/BT/GPS) design is placed on both sides of the Main Board with some minor additions of other cellular chips between them.