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Featured Report Analysis

Market Data: Apple Captive Silicon Market Model - Q1 2025

Explore Apple’s Q1 2025 captive silicon trends — see shipment growth, rising revenues, and forecasts for A-series, M-series, and new S-series chips through 2025.

June 25, 2025

Analysis: Headwinds in China Dragged Honor Down Smartphone Business in Q1 2025

Track Honor’s Q1 2025 performance — see how shipment declines, weak domestic demand, and lower ASPs impacted its outlook as the 7th-largest smartphone maker.

June 25, 2025

Insight: How are Automakers Positioning to Compete in China's New Energy Vehicle Market?

Discover how 15 OEMs navigate China’s competitive auto market — explore diverse investment strategies shaped by overcapacity and rapid EV innovation in this Insight report.

June 25, 2025

Apple M4 Pro SoC HP NPU SOC Design Analysis

Unlock insights into Apple’s M4 Pro NPU design — examine standard cell schematics, routing efficiency, gate density, and DTCO strategies revealed through detailed GDSII analysis.

June 25, 2025

Narrative: Smartphone Memory Market Share Q1 2025

Explore Q1 2025 smartphone memory trends — analyze how delayed demand recovery, price declines, and inventory adjustments drove a 20% revenue drop, with Samsung maintaining market leadership.

June 24, 2025

Analysis: Transsion's Smartphone Shipments Continued to Decline in Q1 2025

Follow Transsion’s Q1 2025 performance — see how shipment declines, market challenges, rising costs, and intensified competition affected its global smartphone ranking.

June 24, 2025

Insight: Low-Light Pedestrian AEB, But Only One Night Vision A Possibility, TriEye SEDAR

Experience next-level night-time safety with TriEye SEDAR — combining SWIR imaging and lidar-like distance measurement to overcome AEB limitations in low-light driving.

June 24, 2025

The NEX Embedded Xeon Adopts Granite Rapids, New Brand

Discover how Intel’s Granite Rapids D CPUs are reshaping edge computing—delivering higher performance and core counts in the new Xeon 6 SoC series, revealed at ISSCC 2025.

June 24, 2025

Analysis: Lenovo-Motorola Smartphone Revenue Grew 27% YoY in Q1 2025

Track Lenovo-Motorola’s 7% YoY shipment growth and rising ASPs in Q1 2025—driven by strong Edge and Razr series sales and momentum in the Indian and Asia Pacific markets.

June 24, 2025

Analysis: Tech Giants in Automotive Infotainment – It’s an Android World

Explore how tech giants like Amazon, Apple, and NVIDIA are shaping automotive infotainment as vehicles shift toward software-defined platforms—highlighting Android’s growing role in this evolving ecosystem.

June 24, 2025

AMD Ryzen Series Strix Halo Advanced Packaging Quick Look Analysis

Uncover AMD’s latest APU innovation with our APQ summary of the AI Max+ 395 “Strix Halo” — explore its 16-core chiplet design, integrated GPU, NPU, and TSMC’s advanced InFO-oS packaging.

June 24, 2025

Huawei's Matebook Fold
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node

TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.

June 23, 2025

Narrative: Smartphone Vendor Market Share in Smaller Markets, Q1 2025

Track global smartphone market trends from Q1 2025—297M units shipped amid geopolitical and tariff pressures. See top vendors, regional highlights, and market share insights.

June 23, 2025

Narrative: Notebook PC Market Share Q1 2025

Discover key insights from our Notebook PC Market Share Tracker—context on vendor, OS, and regional trends, with downloadable data via our Online Data Reports.

June 23, 2025

2025-06-20 - WFE by Application – June 20, 2025

Explore detailed forecasts for Wafer Fab Equipment by application, including Foundry, Logic, and Memory. Backed by financial data, supplier insights, and expert analysis to support CAPEX and market planning.

June 23, 2025

Winbond JAA123 Die (within W664GG6RB-06 Package) 20 nm 4 Gb DDR4

Detailed DPA of Winbond JAA123 die from W664GG6RB-06 package. Features 4 Gb DRAM built on 20 nm CMOS, 2nd-gen of Winbond’s stacked DRAM technology.

June 20, 2025

CPL Biweekly Update – Electromechanical and Integrated Circuits

Electromechanical component prices stayed flat in Q1 2025 and are expected to hold steady. IC price trends align with forecasts, with a Q4 2025 exception.

June 20, 2025

Narrative: India Smartphone Shipments and Marketshare by Model Q1 2025

Explore India’s top 200 best-selling smartphones in Q1 2025. See which brands lead, who's rising, and how local players like Lava are performing.

June 20, 2025

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