MI350 Series Marks AMD’s Push for a Larger Slice of AI
AMD datacenter GPU accelerator MI350 series delivers 4× AI compute and 35× inferencing gains, with CDNA 4 architecture and TSMC 3nm process.
Narrative: 2025 Q3 Global xEV Demand Outlook 2023 to 2032
This update analyzes Global xEV Demand and how US tariffs impact semiconductor and sensor growth across regions and EV powertrain types.
Micron B68S 2yyL 1 Tb TLC 3D NAND Internal Waveform Analysis
An analysis of the program, read, and erase waveforms for the Micron 2yyL 1 Tb TLC 3D NAND Flash device found on the Crucial P510 CT1000P510SSD8 SSD.
Samsung D1a EUV 24Gb DDR5 Memory Floorplan Analysis
Memory Floorplan Analysis of Samsung K4RHE086VP die from DDR5 RDIMM card reveals 4th-gen D1a stacked DRAM process insights.
Ultra Clean Technology Q2 2025 Earnings Summary
These reports provide key takeaways about Ultra Clean Technology's demand and supply from their quarterly earnings call.
Company Earnings: Q2 2025 Intel - Manufacturing Focus
Get key insights on Intel’s demand and supply trends from their latest quarterly earnings call with these complimentary detailed reports.
Nanya 1B nm 16Gb DDR5 DRAM Full Process Essentials
Advanced Memory Essentials analysis of Nanya DDR5 NT5FF2048M8A3-Q5 die reveals 16Gb DRAM built on 2nd-gen 10nm stacked CMOS process.
onsemi AF0130 i-ToF Standard Floorplan Analysis
Floorplan analysis of onsemi AF0130 i-ToF sensor reveals 1.2MP global shutter CMOS die with 3.5µm pixels for depth sensing.
Samsung ISOCELL JNP Standard Floorplan Analysis
Floorplan analysis of Samsung JNP ISP die from Xiaomi Civi 5 Pro’s 50MP selfie camera reveals stacked BI CIS with metaphotonic nanopillars.
CXMT CDTQ G3 12 Gb LPDDR5 DRAM Memory Floorplan Analysis
Memory Floorplan Analysis of CXMT’s CDTQ LPDDR5 DRAM in Huawei Nova 13 Pro reveals 12Gb dies on G3 process in POP MCP package.