• Intel 10 nm Logic Process Analysis (Cannon Lake)
  • Systems on Chips: Industry trends in IoT
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For over 25 years TechInsights has been a trusted patent and technology partner to the world’s largest and most successful companies including 37 of the top 50 U.S. patent holders. By revealing the innovation others can’t inside the broadest range of advanced technology products, we prove patent value and enable business leaders to make the best, fact-based IP and technology investment decisions.

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  • Intel 10 nm Logic Process Analysis
    Intel 10 nm Logic Process Analysis

    TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

    Latest Reports
    SK hynix 72L 3D NAND Analysis
    SK hynix 72L 3D NAND Analysis

    SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

    Latest Reports
    Micron 1x DDR Analysis
    Micron 1x DDR Analysis

    TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

    Latest Reports
  • Samsung’s Anti-Fuse Technology found on 18 nm DRAM: Kilopass 2T-cell Technology used
    Samsung’s Anti-Fuse Technology found on 18 nm DRAM: Kilopass 2T-cell Technology used

    TechInsights is happy to report that we have found and analyzed Anti-fuse array blocks on a Samsung 18 nm DDR4 DRAM die.

    Technology Blog
    Samsung Galaxy S9 Camera Teardown
    Samsung Galaxy S9 Camera Teardown

    We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.

    Technology Blog
    Samsung Galaxy S9 Teardown
    Samsung Galaxy S9 Teardown

    Samsung officially unveiled the latest generation Galaxy S flagship at Mobile World Congress 2018 in Barcelona, the Galaxy S9 and S9+. Our Samsung Galaxy S9 teardown continues. Adding socket wins as we identify them. Costing information is now available!

    Technology Blog
  • Cost Comparison – Samsung Galaxy S9+, Samsung Galaxy Note 8, Samsung Galaxy 8+, Apple iPhone 8+, Apple iPhone X
    Cost Comparison – Samsung Galaxy S9+, Samsung Galaxy Note 8, Samsung Galaxy 8+, Apple iPhone 8+, Apple iPhone X

    TechInsights compares Samsung’s latest offering with its’ most recent releases – the Note 8 and Galaxy S8+ - and with Apple’s iPhone 8+ and iPhone X.

    Technology Blog
    Samsung S5K2X7SP 0.9 µm Image Sensor
    Samsung S5K2X7SP 0.9 µm Image Sensor

    Learn more about what reports we have available and planned for this part.

    Latest Reports
    TechInsights at Mobile World Congress 2018
    Hello Barcelona: TechInsights at Mobile World Congress 2018

    TechInsights’ Stacy Wegner and Daniel Yang will be attending Mobile World Congress 2018. Here’s what they are excited to see.

    Technology Blog
Creating Better Applications Through Patent Strengthening
Creating Better Applications Through Patent Strengthening

Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

Patent Intelligence Blog
What does Uber’s patent landscape look like?
What does Uber’s patent landscape look like?

The IAM blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years. TechInsights' Martin Bijman adds to the story with some competitive landscape analysis.

Patent Intelligence Blog
Artificial Intelligence in the Microsoft Azure IP Advantage Portfolio

It has been a year since Microsoft released the Azure IP Advantage program – a service that "provides the industry’s most comprehensive protection against intellectual property (IP) risks" by making 10,000 of their global patents available to Azure clients.

Patent Intelligence Blogs
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Intel 10 nm Logic Process Analysis
Intel 10 nm Logic Process Analysis

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

Latest Reports
SK hynix 72L 3D NAND Analysis
SK hynix 72L 3D NAND Analysis

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

Latest Reports
Micron 1x DDR Analysis
Micron 1x DDR Analysis

TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise the Micron 1xs.

Latest Reports
    Filter technology posts by:
  • Intel 10 nm Logic Process Analysis
    Intel 10 nm Logic Process Analysis

    TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

    Latest Reports
    SK hynix 72L 3D NAND Analysis
    SK hynix 72L 3D NAND Analysis

    SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

    Latest Reports
    Micron 1x DDR Analysis
    Micron 1x DDR Analysis

    TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

    Latest Reports
  • Samsung S5K2X7SP 0.9 µm Image Sensor
    Samsung S5K2X7SP 0.9 µm Image Sensor

    Learn more about what reports we have available and planned for this part.

    Latest Reports
    Samsung 64L 3D V-NAND

    Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

    Latest Reports
    Toshiba 64L NAND – BiCS FLASH

    Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.

    Latest Reports
TechInsights Webinar IoT Series - Systems on Chip: Industry Trends in IoT

Join TechInsights' Daniel Yang as he reviews the current IoT SoC competitive landscape, and will walk through the design details of some of the world’s leading edge IoT SoCs.

Latest Events
Knowledge Group Webinar - Patent Portfolio Management: Best Practices in 2018

Join TechInsights' Van Thompson for this live webinar, hosted by The Knowledge Group.

Latest Events
TechInsights Webinar TIPS Series - Automotive Patents: Owners, Technologies, and Investigating for EOU

Join TechInsights' Jim Hines as he provides examples of information and strategies to prepare for the upcoming acceleration of automotive IP management and monetization.

Latest Events
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SK hynix 72L 3D NAND Analysis
SK hynix 72L 3D NAND Analysis

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

Latest Reports
Micron 1x DDR Analysis
Micron 1x DDR Analysis

TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

Latest Reports
Intel/Micron 64L 3D NAND Analysis

The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

Latest Reports
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Intel 10 nm Logic Process Analysis
Intel 10 nm Logic Process Analysis

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

Latest Reports
Samsung’s Anti-Fuse Technology found on 18 nm DRAM: Kilopass 2T-cell Technology used
Samsung’s Anti-Fuse Technology found on 18 nm DRAM: Kilopass 2T-cell Technology used

TechInsights is happy to report that we have found and analyzed Anti-fuse array blocks on a Samsung 18 nm DDR4 DRAM die.

Technology Blog
10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
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Technology Blog
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Samsung Galaxy S9 Camera Teardown
Samsung Galaxy S9 Camera Teardown

We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.

Technology Blog
Image Sensor Technology: Noteworthy Developments in 2017

We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.

Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)
These structures are critical to the performance of 1.0 µm to 1.4 µm generation pixels in smartphone cameras.
View Post
Technology Blog
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SK hynix 72L 3D NAND Analysis
SK hynix 72L 3D NAND Analysis

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

Latest Reports
Micron 1x DDR Analysis
Micron 1x DDR Analysis

TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

Latest Reports
Samsung 64L 3D V-NAND

Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

Latest Reports
    Filter technology posts by:
Intel 10 nm Logic Process Analysis
Intel 10 nm Logic Process Analysis

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

Latest Reports
Samsung 18 nm DRAM Analysis

TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

Latest Reports
TSMC 10 nm Process

TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

Latest Reports
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Samsung Galaxy S9 Camera Teardown
Samsung Galaxy S9 Camera Teardown

We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.

Technology Blog
Samsung S5K2X7SP 0.9 µm Image Sensor
Samsung S5K2X7SP 0.9 µm Image Sensor

Learn more about what reports we have available and planned for this part.

Latest Reports
Sony IMX400 3-Layer Stacked (Exmor RS) CMOS Image Sensor

Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS "Motion Eye" camera offering with 960 fps video and predictive capture.

Latest Reports
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Qualcomm Latest RF360 Chipset

The Qualcomm RF360 Chipset includes the WTR5975 Gigabit LTE Transceiver, QET4100 Envelope Tracker and the Snapdragon X16 LTE MDM9250 Modem.

Latest Reports
Apple W1 343S00131 Bluetooth Module

The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.

Latest Reports
Intel PMB5750 LTE Tranceiver Circuit Analysis

This report is a circuit analysis of the Intel PMB5750 LTE Tranceiver. Apple’s use of the Intel modem chipset is a huge event in the industry as Intel modems will represent a minority of iPhone shipments (est. 22 M units in 2016 and 23 M units in 2017).

Latest Reports