Product Code
Release Date
Product Item Code
Device Manufacturer
Device Type
Logic - Digital Floorplan
Logic - Digital Floorplan (IP)
AMD Ryzen 9 5950X TSMC N7 HPC FinFET Process Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the AMD BRCCD die found inside the AMD Ryzen 9 5950X (100-000000059) desktop microprocessor. The AMD Ryzen 9 5950X features the AMD Zen3 architecture.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at levels including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision software
  • Cost of die based on the manufacturing cost analysis of the observed process

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