Webinar: Technical and Financial Teardown of the Apple iPhone 13 Pro

Technical and Financial Teardown of the Apple iPhone 13

A webinar presented by TechInsights in collaboration with Bloomberg Intelligence

Originally presented: October 2021

 

TechInsights and Bloomberg Intelligence Analysts presented their findings on this year’s Apple flagship phone, the iPhone 13 Pro, in this webinar presentation.

Technical and Financial Teardown of the Apple iPhone 13

Bloomberg Intelligence analyst Woo Jin Ho will explore the financial implications for the Apple semiconductor ecosystem. Apple and its chip ecosystem are navigating a challenging supply environment, which may have played a role in the final iPhone 13 Pro design and could weigh on iPhone launch volumes and consequently chipmaker sales. In contrast, iPhone demand should remain high in 2021-22, fueled by the recovering macroeconomy and 5G.

TechInsights’ Stacy Wegner will discuss notable design wins, technology innovations, and she will present a high-level comparison between last year’s iPhone 12 Pro and the iPhone 13 Pro. Stacy will also discuss preliminary build costs for the iPhone 13 Pro.

The information presented in this webinar will be of greatest interest to those looking to understand the semiconductor design wins of the iPhone 13 Pro, and related financial implications to companies like Qualcomm, Broadcom, Skyworks, Qorvo, and more.

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Technical and Financial Teardown of the Apple iPhone 13 Webinar!

About the presenters

Stacy Wegner

Stacy Wegner

Stacy Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by analysts is transformed into consumable competitive intelligence. Stacy has an extensive background in advanced technology devices and marketplace analysis.

Woo Jin Ho

Woo Jin Ho

Woo Jin Ho is the Senior Technology Analyst for Bloomberg Intelligence. His research focuses on next-generation networking, such as software-defined networks and high-speed optics, in the networking sector, and Apple iPhone supply chain and analog chips in the semiconductor sector. His current coverage includes Analog Devices, Onsemi, Microchip, Skyworks, Qorvo, Cisco, Juniper Networks, Arista. Prior to joining Bloomberg, he was a sell-side equity research analyst covering the networking and enterprise, imaging sectors for Nomura Securities, Merrill Lynch – BofA, and CIBC Oppenheimer.

Apple iPhone 13 Pro Teardown Analysis

Apple iPhone teardown summary now available! Download our early summary of analysis and costing on the iPhone 13, including a partially annotated high resolution die photo of the Apple A15 processor.

Take a look inside

Tags:  Apple    iPhone 13    Teardown    A15    TSMC    GPU  

 

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