• Toshiba THGBX6T1T82LFXF 3D NAND Flash Process and Circuit Analysis Reports

  • This report is a 3D NAND flash process and circuit analysis of the Toshiba THGBX6T1T82LFXF.

    The NAND Flash in the Apple iPhone 7 256 GB version was populated with the Toshiba brand new 48 layer 3D NAND Flash.

    TechInsights has produced an Advanced CMOS Essentials in-depth process analysis on the Toshiba 48 layer 3D NAND. The Advanced CMOS Essentials (ACE) deliverable for NAND Flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features. WE will also be producing an in-depth circuit design analysis reports on the Toshiba 48 layer 3D NAND Flash.

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    Our reports are delivered in a CircuitVision™ format. This provides a highly interactive, easy to navigate view into circuit designs, and the physical implementation on the IC. Allowing our customers to gain a deep understanding of device functionality, structure, and layout.

    Interested in Circuit Analysis on this device? Lean about our circuit capabilities here, and contact us.

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