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Published: 12 June 2018


This report presents a Memory Functional Analysis of the Samsung K4F6S164HA LPDDR4X die found inside the Samsung K3UH6H60AM-AGCJ POP. The K3UH6H60AM-AGCJ POP was extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965F.

This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs through the bit line (BL) showing the general structure of the DRAM cell array, die dielectric materials, and major features
  • SEM bevel through the memory array showing the active, bit and word line level plan-view features
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to diffusion layer
  • Identification of major functional blocks on a diffusion layer die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software

Report Description

This report presents a Memory Functional Analysis of the Samsung K4F6S164HA LPDDR4X die found inside the Samsung K3UH6H60AM-AGCJ package-on-package (POP). The K3UH6H60AM-AGCJ POP was extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965F.

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