This report presents a Memory Design – Cell (MDC) layout of the SK Hynix H27EGLM_72L die found inside the SK Hynix H27Q2T8QQA3R-BDG package. The H27Q2T8QQA3R-BDG was extracted from an SK Hynix HFS512GD9TNG-62A0A solid state drive.

This report contains the following detailed information:

• Package photographs and top metal and polysilicon die photographs
• SEM cross-sectional micrographs through the NAND cell array showing the general structure of the NAND cell array, die dielectric materials, and major features
• SEM bevel micrographs through the memory array showing the memory array at the substrate, lower pipe gate, upper pipe gate, mid-height channel tubes, polysilicon plugs over channel tubes, top surface of polysilicon plugs, via 0s, metal 1, metal 2, and metal 3 levels
• Memory cell layout analysis using colorized and overlaid SEM bevel images
• Cell Array Circuit Diagram