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Published: 30 May 2018


This report presents a Digital Functional Analysis of the Qualcomm HG11-P7872-2 die found inside the Qualcomm SDM845 package-on-package (PoP) component. The SDM845 was extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965U.

This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/STI, gate, contacts and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the ICWorks Browser

Report Description

This report presents a Digital Functional Analysis of the Qualcomm HG11-P7872-2 die found inside the Qualcomm SDM845 package-on-package (PoP) component. The SDM845 was extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965U.

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