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Published: 24 January 2018


This report presents a Digital Functional Analysis of the HiSilicon HI3670 application processor die found inside the HiSilicon 3670 PoP component, also known as the Kirin 960.

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gates, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser

Report Description

This report presents a Digital Functional Analysis of the HiSilicon HI3670 application processor die found inside the HiSilicon 3670 PoP component, also known as the Kirin 960.

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