Interested in this report?

Published: 29 July 2016


This report presents a Basic Functional Analysis of the Egis Technology ET300 die found inside Egis Technology ET300 component. This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
  • Report Description

    This report presents a Basic Functional Analysis of the Egis Technology ET300 die found inside Egis Technology ET300 component.

    Recent OMR Reports

    FAR-1810-808  |   Published: 24 October 2025
    This report presents a Basic Functional Analysis of the Apple TMIR36 die found inside the Apple W3 338S00464 component. The W3 338S00464 was extracted from the S4 system in package (SiP) module, which...
    EXR-1810-801  |   Published: 3 October 2025
    EXR-1810-801 - NXP NFC Controller 100VB27 - Apple iPhone Xs Exploratory Report
    SCE-1805-802  |   Published: 14 December 2018
    This project presents a Standard Cell Essentials analysis of Intel 10 nm finFET high-k metal (HKMG) CMOS process found in the Intel i3-8121U Cannon Lake laptop processor. In this analysis we assessed the...