Product Code
FAR-1605-803
Release Date
Availability
Published
Product Item Code
QUA-QBT1000
Device Manufacturer
Qualcomm
Device Type
Other
Qualcomm QBT1000 Snapdragon Sense ID Controller Basic Functional Analysis
This report presents a Basic Functional Analysis of the Qualcomm HG11-NJ670-400 die found inside the Qualcomm QBT1000 package.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

Make informed business decisions faster and with greater confidence

Start My Free Trial

 

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.