Interested in this report?

Published: 11 August 2017


This report presents a CircuitVision Analysis on the Qualcomm QET4100 envelope tracker. The Qualcomm QET4100 envelope tracker die consists of boost regulators, linear regulator, average power tracking, envelope tracking and biasing circuitry block. This report includes a full set of hierarchal schematics and annotated photos and X-rays for the envelope tracker integrated
circuit (IC). This report also includes layout data to allow the audience to cross-probe devices and signals of interest to allow visual correlations between the schematic and layout information for a deeper understanding of the circuit functionality and design.

Report Description

This report presents a CircuitVision Analysis on the Qualcomm QET4100 envelope tracker.

Recent OMR Reports

EXR-1810-801  |   Published: 3 October 2025
EXR-1810-801 - NXP NFC Controller 100VB27 - Apple iPhone Xs Exploratory Report
CWR-1711-902  |   Published: 16 January 2019
FAR-1811-806  |   Published: 16 January 2019
This report presents a Basic Floorplan Analysis of the Microchip Technology BT5506A found inside the Microchip Technology IS2064GM-0L3 package. The IS2064GM-0L3 package was extracted from the Audeze Mobius...