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Published: 25 June 2018


The Advanced Memory Essentials (AME) deliverable for 3D NAND Flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the in-depth image folders.

The in-depth image folders will contain the following:

  • Downstream product teardown images
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic region and NAND flash SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • Two TEM cross sections, orthogonal to the word and bit lines, showing the NAND flash array cells, the lower metals and dielectrics, transistor gates, isolation, and other FEOL feature
  • TEM bevel through the NAND flash
  • TEM-EDS and TEM-EELS analyses of main materials
The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitor

Report Description

This report is an Advanced Memory Essentials in-depth process analysis on the SK Hynix 72 layer 3D NAND flash.

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The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders: ...