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The Advanced Memory Essentials (AME) deliverable for 3D NAND Flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the in-depth image folders.
The in-depth image folders will contain the following:
Downstream product teardown images
Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
SEM bevel through the logic region and NAND flash SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
Two TEM cross sections, orthogonal to the word and bit lines, showing the NAND flash array cells, the lower metals and dielectrics, transistor gates, isolation, and other FEOL feature
TEM bevel through the NAND flash
TEM-EDS and TEM-EELS analyses of main materials
The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitor
This report is an Advanced Memory Essentials in-depth process analysis on the SK Hynix 72 layer 3D NAND flash.