Interested in this report?

Published: 5 April 2018


The Advanced Memory Essentials (AME) deliverable embedded eNOR flash comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

  • Downstream product teardown
  • Package X-rays, top metal and polysilicon die photographs, non-invasive optical photographs of die features
  • SEM bevel through the flash memory array and periphery logic
  • SEM cross section of the general device structure, flash memory along bit lines
  • Four TEM cross sections, HV transistors, logic transistors, flash memory along bit lines, metals/ILD stack
The results of TEM-EDS analyses are included in the AME summary document. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.

Report Description

This product presents an Advanced Memory Essentials Image Set and Summary of the Ambiq Micro C01 Apollo2 MCU with embedded 40 nm eNOR flash memory.

Recent OMR Reports

EXR-1810-801  |   Published: 3 October 2025
EXR-1810-801 - NXP NFC Controller 100VB27 - Apple iPhone Xs Exploratory Report
EXR-1901-802  |   Published: 12 February 2019
This report presents an Exploratory Analysis of the SK Hynix DRAM 2nd generation high-bandwidth memory (HBM2) package from the AMD 215-0894144 Vega 10 XT graphics processor package.
DEF-1901-801  |   Published: 11 February 2019
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders: ...