Interested in this report?

Published: 9 March 2018


The complete ACE Part 2 deliverable includes a concise analyst’s summary of critical device metrics, with focus on salient word line and bit line connectivity features and supported by the following analyses and image folders:

  • Large area scanning electron microscopy (SEM) image mosaic of word line and bit line areas, showing all metal levels required to extract connectivity of the array to the word line and bit line decoder regions
  • SEM image mosaics viewable in the CircuitVisionsoftware
  • Low-voltage (LV) and high-voltage (HV) periphery transistor transmission electron microscopy (TEM) detail images
  • Extended materials analysis, including energy dispersive X-ray spectroscopy (EDS) and electron energy loss spectroscopy (EELS) line scan data
  • Tabular summary of key dimensions
The results of TEM-EDS analyses are included in the ACE summary document. The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.

Report Description

This product presents Part 2 of an Advanced Memory Cell Essentials of the Intel 29F01T2ANCTH2 64-Layer 3D NAND flash.

Recent OMR Reports

EXR-1810-801  |   Published: 3 October 2025
EXR-1810-801 - NXP NFC Controller 100VB27 - Apple iPhone Xs Exploratory Report
DEF-1810-801  |   Published: 19 November 2018
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders: ...
CAR-1806-201  |   Published: 14 November 2018
The report presents a CircuitVision Analysis of selected blocks on the Samsung Shannon 955 RF transceiver.