Interested in this report?

Published: 29 September 2017


The Advanced CMOS Essentials (ACE) deliverable for NAND Flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic region and NAND flash
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • One or Two TEM cross sections, orthogonal to the word and/or bit lines, showing the NAND flash array cells, the lower metals and dielectrics, transistor gates, isolation, and other FEOL features
  • TEM bevel through the NAND flash
The results of TEM-EDS analyses are included in the ACE summary document. The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.

Report Description

This product presents Part 1 of an Advanced CMOS Essentials of the SanDisk/Toshiba 64-Layer 256Gb 3D NAND flash.

Recent OMR Reports

EXR-1810-801  |   Published: 3 October 2025
EXR-1810-801 - NXP NFC Controller 100VB27 - Apple iPhone Xs Exploratory Report
CWR-1711-902  |   Published: 16 January 2019
FAR-1811-806  |   Published: 16 January 2019
This report presents a Basic Floorplan Analysis of the Microchip Technology BT5506A found inside the Microchip Technology IS2064GM-0L3 package. The IS2064GM-0L3 package was extracted from the Audeze Mobius...