Posted: August, 2019
This month’s newsletter includes recent pieces about MMwave technology, the next generation of DDR4 devices, the use of SiC and GaN in efficient high-power AC adapters, and a 4-part series on the state of the art of imagers in Smartphones.
FEATURED TECHNOLOGY / IP BLOGS & ANALYSIS
TechInsights has been actively analyzing 5G chipsets, including HiSilicon’s 5G solution. Since Huawei’s first 5G phone Mate 20 X (5G) was announced, we have been interested in seeing what new components are inside. Our procurement successfully acquired the Huawei Mate 20 X (5G). The model is EVR-N29, with 256 GB + 8 GB.
Blog outline of the talk was structured in four parts:
Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. In the QTM052, Qualcomm combines 5G NR transceivers, power management and RF front-end components including power amplification and a phased antenna array.
The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was reached with the introduction of 1y by Samsung with their DDR4/LPDDR4X and Micron with their DDR4.
TECHNOLOGY / IP NEWS & WEBINARS
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.