Survey Plus Teardown of the Xiaomi Redmi Note 8 Pro

Product Code
Release Date
In Creation
Product Item Code
Device Manufacturer
Xiaomi Tech
Device Type
Multi-band Handset
TD - Mobile
Report Code
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
Teardown Subscription

Access the data you need faster than ever

Our subscription-based service gives you 24/7 online access to channel specific reports, images, supply chain relationships, and more, revealing the inner workings and secrets of innovative technologies, form factors, and feature sets.