This report presents a Package Analysis of the AMD 215-0862040 graphics processor extracted from the AMD Radeon R9 Fury X graphics card. The AMD graphics processor package is a 2.5D multichip ball grid array (BGA) package consisting of the GPU die and four Hynix 3D high bandwidth memory (HBM) packages attached to a common silicon interposer using copper micro bumps. The 3D HBM package comprises five stacked dies, including four HBM DRAM dies stacked on a controller die, interconnected through TSVs and micro copper bumps. The silicon interposer comprises three metal interconnect layers on the front side, TSVs, and one metal layer on the back side; it is attached to the PWB using C4 solder bumps.