
- Package optical photographs, package X-ray images, die photographs, and optical photographs of die features
- Scanning electron microscope (SEM) plan-view images of the device delayered to the gate level
- Exploratory cross-sectional SEM images of the device structure
- Detailed cross-sectional scanning microwave impedance microscopy (sMIM) analysis of the dopant structures
- Spreading resistance profiling (SRP) of the substrate dopant structure
The Power Essentials deliverable provides basic competitive benchmarking information and enables cost-effective tracking of multiple competitors’ technology.