Product Code
MFR-2008-801
Availability
Published
Product Item Code
CYP-CY15V104QSN
Device Manufacturer
Cypress Semiconductor
Device Type
FRAM
Subscription
Memory - Embedded & Emerging
Channel
Memory - Embedded & Emerging Floorplan Analysis
Cypress Semiconductor CY15V104QSN Excelon Ultra 4 Mb F-RAM Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Cypress 7C15004B die, found inside the Cypress CY15V104QSN Excelon Ultra. The Cypress CY15V104QSN Excelon Ultra component combines a 4 Mbit FRAM with the high-speed quad serial peripheral interface SDR and DDR interfaces which enhances the non-volatile write capability of FRAM technology. It has a low-voltage operation, with a VDD of 1.71-1.89 V. The package is 3.24 mm × 3.27 mm × 0.47 mm thick.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Plan-view SEM micrograph of the die delayered to the WL and BL layers
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in CircuitVision
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
The authoritative information platform to the semiconductor industry.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
1891 Robertson Rd #500, Nepean, ON K2H 5B7
Copyright © 2024 TechInsights Inc. All rights reserved.