SanDisk TP70G76AWV02008N 96-Layer QLC 3D NAND Memory Floorplan Analysis

Product Code
MFR-2007-802
Release Date
18/09/2020
Availability
Published
Product Item Code
SAN-TP70G76AWV
Device Manufacturer
SanDisk
Device Type
NAND Flash
Subscription
Memory - NAND & DRAM
Channel
Memory - NAND Floorplan Analysis
Report Code
MFR-2007-802
This report presents a Memory Floorplan Analysis of the SanDisk FSPO_1.33T found inside SanDisk TP70G76AWV02008N. The TP70G76AWV02008N was extracted from the X002IP5MTP.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Plan-view SEM micrograph of the die delayered to the WL and BL layers
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in CircuitVision
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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