Product Code
MFR-1808-805
Release Date
Availability
Published
Product Item Code
SPA-S6J335EKSCSE20000
Device Manufacturer
SPANSION
Device Type
Microcontrollers
Subscription
Memory - Embedded & Emerging
Memory - NAND & DRAM
Channel
Memory - Embedded & Emerging Floorplan Analysis
Memory - NAND Floorplan Analysis
Spansion/Cypress S6J335EKSCSE20000 40 nm 2nd Generation eFlash Memory Functional Analysis
This report presents a Memory Functional Analysis of the Cypress 0J004 die found inside the Spansion/Cypress S6J335EKSCSE20000 device.

This report contains the following detailed information:
  • Package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to polysilicon, metal 1 to metal 3
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

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