
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- Scanning electron microscopy (SEM) cross-sectional micrographs through the bit line (BL) showing the general structure of the DRAM cell array, die dielectric materials, and major features
- SEM bevel through the memory array showing the active, bit and word line level plan-view features
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to diffusion layer
- Identification of major functional blocks on a diffusion layer die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software