This Imager Process Review on the NC81361A from the Nikon D3s DSLR goes inside the process technology of this leading sensor technology. This report includes camera teardown images, die photographs and die markings, as well as the dimensions of the major microstructural features. Scanning electron microscopy (SEM), and cross-sectional micrographs of the dielectric materials using a transmission electron microscope (TEM) are used for this analysis.