Product Code
FAR-1707-804
Availability
Published
Product Item Code
NUL-Hi2110
Device Manufacturer
Neul
Device Type
Baseband Processor
Subscription
IoT Connectivity SoC
Logic
Channel
IoT Connectivity SoC - Transceiver Floorplan
Logic - Digital Floorplan
Report Code
FAR-1707-804
Image
This report presents a Digital Functional Analysis of the Neul Boudica die found inside of the Neul Hi2110 NB IoT modem. The Hi2110 component was extracted from the Quectel BC95B5HB-02-STD NB IoT module.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/STI, gate, contacts and minimum pitch metals
- Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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