Broadcom BCM3390 DOCSIS 3.1 Cable Modem SoC Advanced Functional Analysis Report

Product Code
FAR-1510-801
Release Date
27/11/2015
Availability
Published
Product Item Code
BRO-BCM3390ZDKFSBB6ZG
Device Manufacturer
Broadcom
Device Type
SoC (System-on-Chip)
Report Code
FAR-1510-801
This report presents an Advanced Functional Analysis on the Broadcom BCM3390. The Broadcom BCM3390 is a DOCSIS 3.1 cable modem system-on-chip (SoC), including two orthogonal frequency-division multiplexing (OFDM) downstream channels, two OFDM upstream channels, 32 quadrature amplitude modulation (QAM) downstream channels, and eight QAM upstream channels. The BCM3390 cable modem is packaged in a 1,414 pin, Pb-free, flip-chip ball grid array (FCBGA) package. The die is manufactured in a 28 nm CMOS process employing shallow trench isolation (STI), a gate-last poly-gate replacement high-k metal gate (HKMG) process flow, nine levels of copper (Cu) metallization, and a top layer of aluminum (Al) metallization.

This report contains the following detailed information:
  • Package photographs, package X-ray images, die markings, top metal die photograph, and metal 1 or polysilicon die photograph
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional blocks sizes and percentage of die utilization
  • High-resolution top metal, and poly die photographs delivered in the ICWorks Browser
  • Measurement of vertical and horizontal dimensions of the major microstructural features
  • Scanning electron microscope (SEM) cross-sectional micrographs of dielectric materials, metallization, transistors, and embedded flash memory elements
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.

Don't miss another update from TechInsights.

All our latest content updates sent to you a few times a month.