This report presents an Advanced Functional Analysis on the Broadcom BCM3390. The Broadcom BCM3390 is a DOCSIS 3.1 cable modem system-on-chip (SoC), including two orthogonal frequency-division multiplexing (OFDM) downstream channels, two OFDM upstream channels, 32 quadrature amplitude modulation (QAM) downstream channels, and eight QAM upstream channels. The BCM3390 cable modem is packaged in a 1,414 pin, Pb-free, flip-chip ball grid array (FCBGA) package. The die is manufactured in a 28 nm CMOS process employing shallow trench isolation (STI), a gate-last poly-gate replacement high-k metal gate (HKMG) process flow, nine levels of copper (Cu) metallization, and a top layer of aluminum (Al) metallization.

This report contains the following detailed information:

• Package photographs, package X-ray images, die markings, top metal die photograph, and metal 1 or polysilicon die photograph
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional blocks sizes and percentage of die utilization
• High-resolution top metal, and poly die photographs delivered in the ICWorks Browser
• Measurement of vertical and horizontal dimensions of the major microstructural features
• Scanning electron microscope (SEM) cross-sectional micrographs of dielectric materials, metallization, transistors, and embedded flash memory elements